Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8132305 | Equipment and method for cutting package | Tai-Kew Choi, Hee-Sang Yang, Yo-Se Eum, Ho-Soo Jang | 2012-03-13 |
| 7650687 | Die attaching apparatus | Jung-Hwan Woo, Ho-Jae Byon, Jae Bong Shin, Hyun-Ho Kim, Choo-ho KIM +1 more | 2010-01-26 |
| 7602171 | System for testing memory modules using a rotating-type module mounting portion | Sun Choi, Dong Soo Lee, Hyun-Ho Kim | 2009-10-13 |
| 6105567 | Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation | Sam Bok Jang, Dong Sung JANG | 2000-08-22 |