Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10058952 | Bonding stage and bonding apparatus comprising the same | Seung Dae Seok, Sang-Yoon Kim, Hui-Jae Kim, Byung Joon LEE | 2018-08-28 |
| 9508577 | Semiconductor manufacturing apparatuses comprising bonding heads | Byung Joon LEE, Masato KAJINAMI, Yoshiaki Yukimori, Sang-Yoon Kim, Hui-Jae Kim +3 more | 2016-11-29 |
| 9431365 | Apparatus for bonding semiconductor chips | Seung Dae Seok, Sang-Yoon Kim, Hui-Jae Kim | 2016-08-30 |
| 7650687 | Die attaching apparatus | Jung-Hwan Woo, Ho-Jae Byon, Yong-Kyun Sun, Hyun-Ho Kim, Choo-ho KIM +1 more | 2010-01-26 |
| 7294204 | Apparatus for painting traffic marks on road surface | Daehie Hong, Jung-yup Kim, Hyun Ho Shin, Woo Chang Lee, In-Ju Hwang +1 more | 2007-11-13 |