Seung Dae Seok — 6 Patents at Samsung

Seung Dae Seok has been granted 6 US patents while listed as an inventor at Samsung. The first was granted in 2016 and the most recent in September 2024. Seung Dae Seok ranks #779,687 of 4,157,543 US inventors in our database (top 18.8%). Patent records list Seung Dae Seok in Yongin-si, KR.

Patents per Year

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #	Title	Co-Inventors	Date
12090642	Die pickup module and die bonding apparatus including the same	Chang Bu Jeong, Jong Sung Park, Jung Sub Kim, Young Gun Park, Dae Seok Choi +5 more	2024-09-17
11600515	Die pickup module and die bonding apparatus including the same	Chang Bu Jeong, Min-Gu LEE, Eui Sun Choi, Kang San Lee, Dae Ho Min	2023-03-07
10058952	Bonding stage and bonding apparatus comprising the same	Sang-Yoon Kim, Hui-Jae Kim, Jae Bong Shin, Byung Joon LEE	2018-08-28
9620476	Bonding head and die bonding apparatus having the same	Hang Lim LEE, Jong Jin Weon, Soon Hyun KIM	2017-04-11
9508577	Semiconductor manufacturing apparatuses comprising bonding heads	Byung Joon LEE, Masato KAJINAMI, Yoshiaki Yukimori, Sang-Yoon Kim, Hui-Jae Kim +3 more	2016-11-29
9431365	Apparatus for bonding semiconductor chips	Sang-Yoon Kim, Hui-Jae Kim, Jae Bong Shin	2016-08-30