Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12325088 | Head assembly for mounting conductive ball | Youn Sung Ko, GEUNSIK AHN | 2025-06-10 |
| 12217995 | Method of mounting conductive balls using electrostatic chuck | Youn Sung Ko | 2025-02-04 |
| 10804239 | Apparatus for mounting conductive ball | Youn Sung Ko | 2020-10-13 |
| 10804240 | Method of mounting conductive ball | Youn Sung Ko | 2020-10-13 |
| 9726204 | Fluid pressure actuator | Masato KAJINAMI, Fumitaka MOROISHI, Keiji Murata, Shinji Ueyama, Tatsuya Ishimoto | 2017-08-08 |
| 9508577 | Semiconductor manufacturing apparatuses comprising bonding heads | Byung Joon LEE, Masato KAJINAMI, Sang-Yoon Kim, Hui-Jae Kim, Byeong Kuk Park +3 more | 2016-11-29 |
| 9082885 | Semiconductor chip bonding apparatus and method of forming semiconductor device using the same | Shinji Ueyama, Masato KAJINAMI | 2015-07-14 |