Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051604 | Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device | Daisuke NAGATOMO, Fumitaka MOROISHI, Masanori Izumita, Shinji Ueyama, Takahiro Tokumiya +2 more | 2024-07-30 |
| 11314073 | Lighting device and inspection apparatus having the same | Yasuhiro Hidaka, Takayuki Sasaoka | 2022-04-26 |
| 10847369 | Wafer bonding method, method for manufacturing semiconductor device, and apparatus therefor | Shinji Ueyama, Fumitaka MOROISHI | 2020-11-24 |
| 10823682 | Water measurement apparatus | Takamasa Sugiura, Fumitaka MOROISHI | 2020-11-03 |
| 10444162 | Method of testing an object and apparatus for performing the same | Shinji Ueyama, Tatsuya Ishimoto | 2019-10-15 |
| 9726204 | Fluid pressure actuator | Fumitaka MOROISHI, Keiji Murata, Shinji Ueyama, Tatsuya Ishimoto, Yoshiaki Yukimori | 2017-08-08 |
| 9508577 | Semiconductor manufacturing apparatuses comprising bonding heads | Byung Joon LEE, Yoshiaki Yukimori, Sang-Yoon Kim, Hui-Jae Kim, Byeong Kuk Park +3 more | 2016-11-29 |
| 9082885 | Semiconductor chip bonding apparatus and method of forming semiconductor device using the same | Yoshiaki Yukimori, Shinji Ueyama | 2015-07-14 |