Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784130 | Bonding apparatus | Joong-Ha LEE, Sang-Yoon Kim, Youngbum Kim, Seungdae Seok, Jaebong Shin +3 more | 2020-09-22 |
| 10058952 | Bonding stage and bonding apparatus comprising the same | Seung Dae Seok, Sang-Yoon Kim, Jae Bong Shin, Byung Joon LEE | 2018-08-28 |
| 9508577 | Semiconductor manufacturing apparatuses comprising bonding heads | Byung Joon LEE, Masato KAJINAMI, Yoshiaki Yukimori, Sang-Yoon Kim, Byeong Kuk Park +3 more | 2016-11-29 |
| 9431365 | Apparatus for bonding semiconductor chips | Seung Dae Seok, Sang-Yoon Kim, Jae Bong Shin | 2016-08-30 |