Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12325088 | Head assembly for mounting conductive ball | Youn Sung Ko, Yoshiaki Yukimori | 2025-06-10 |
| 12237296 | System for laser bonding of flip chip | Youn Sung Ko | 2025-02-25 |
| 12237295 | Flip chip laser bonding system | — | 2025-02-25 |
| 11810890 | Flip-chip bonding apparatus using VCSEL device | Youn Sung Ko | 2023-11-07 |
| 11358236 | Mask changing unit for laser bonding apparatus | — | 2022-06-14 |
| 10497665 | Apparatus for laser bonding of flip chip and method for laser bonding of flip chip | — | 2019-12-03 |
| 10483228 | Apparatus for bonding semiconductor chip and method for bonding semiconductor chip | — | 2019-11-19 |