Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12082313 | Heater assembly and bonding head including same | Byung Geun Kim, Byoung-chan Lee | 2024-09-03 |
| 9620476 | Bonding head and die bonding apparatus having the same | Hang Lim LEE, Jong Jin Weon, Seung Dae Seok | 2017-04-11 |