JW

Jong Jin Weon

SC Semes Co.: 1 patents #467 of 991Top 50%
Samsung: 1 patents #49,284 of 75,807Top 70%
Overall (All Time): #2,939,790 of 4,157,543Top 75%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9620476 Bonding head and die bonding apparatus having the same Hang Lim LEE, Soon Hyun KIM, Seung Dae Seok 2017-04-11