Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12090642 | Die pickup module and die bonding apparatus including the same | Chang Bu Jeong, Jong Sung Park, Jung Sub Kim, Dae Seok Choi, Sang Hoon Jung +5 more | 2024-09-17 |
| 10373750 | Apparatus and method of generating momentum using superconducting coils | Tae Kuk Ko, Ji Ho LEE, Woo Seung Lee, Hyung Jun Kim, Seok Ho Nam +1 more | 2019-08-06 |