Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7481351 | Wire bonding apparatus and method for clamping a wire | Tae Hyun Kim, Youn Sung Ko, Dae-Soo Kim, Kook-Jin Oh, Sang-Woo Lee +1 more | 2009-01-27 |
| 7215008 | In-line apparatus and method for manufacturing double-sided stacked multi-chip packages | Tae Hyun Kim, Hyun-Ho Kim, Jung-Hwan Woo | 2007-05-08 |
| 7074646 | In-line die attaching and curing apparatus for a multi-chip package | Hyun-Ho Kim, Kyoung-Bok Cho, Sung-Bok Hong | 2006-07-11 |
| 6863109 | In-line die attaching and curing apparatus for a multi-chip package | Hyun-Ho Kim, Kyoung-Bok Cho, Sung-Bok Hong | 2005-03-08 |