Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239104 | Chip ejecting apparatus | Sang Hwan Kim, Min Sung Kim | 2022-02-01 |
| 8042593 | Semiconductor chip bonding apparatus | Cheal-Sang Yoon, Yong-Dae Ha, Jeong-Soon Cho, Bum Woo Lee, Pil-June Kim | 2011-10-25 |