Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6187121 | Die-bonding equipment and a method for detecting residual adhesive material using the same | Sung-Bok Hong, Yong-Dae Ha, Young-Gon Hwang | 2001-02-13 |
| 6053234 | Lead frame transfer device and wire bonding apparatus comprising the same | Deog Gyu Kim, Sung-Hee Cho, Jong Hwan Jeon | 2000-04-25 |
| 5987722 | Apparatus for transporting lead frames | Bok Sik Park, Deog Gyu Kim, Sung-Hee Cho | 1999-11-23 |
| 5653575 | Apparatus for transferring lead frame | Bok Sik Park, Sung-Hee Cho, Deog Gyu Kim | 1997-08-05 |