Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991157 | Method for depositing a diffusion barrier layer and a metal conductive layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2018-06-05 |
| 9390970 | Method for depositing a diffusion barrier layer and a metal conductive layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2016-07-12 |
| 8158511 | Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2012-04-17 |
| 7989343 | Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2011-08-02 |
| 7795138 | Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2010-09-14 |
| 7687909 | Metal / metal nitride barrier layer for semiconductor device applications | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more | 2010-03-30 |
| 7589016 | Method of depositing a sculptured copper seed layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2009-09-15 |
| 7381639 | Method of depositing a metal seed layer on semiconductor substrates | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2008-06-03 |
| 7253109 | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more | 2007-08-07 |
| 7074714 | Method of depositing a metal seed layer on semiconductor substrates | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2006-07-11 |
| 6919275 | Method of preventing diffusion of copper through a tantalum-comprising barrier layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2005-07-19 |
| 6758947 | Damage-free sculptured coating deposition | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2004-07-06 |
| 6620250 | Method and apparatus for shielding a device from a semiconductor wafer process chamber | Thomas Brezoczky, Randy D. Schmieding | 2003-09-16 |
| 6271592 | Sputter deposited barrier layers | Edwin Kim, Michael Nam, Chris Cha, Gongda Yao, Sophia Lee +2 more | 2001-08-07 |
| 6110821 | Method for forming titanium silicide in situ | Fusen Chen, Hyman J. Levinstein, Zheng Xu, Peijun Ding, Gongda Yao +1 more | 2000-08-29 |
| 5985759 | Oxygen enhancement of ion metal plasma (IMP) sputter deposited barrier layers | Edwin Kim, Michael Nam, Chris Cha, Gongda Yao, Sophia Lee +2 more | 1999-11-16 |