Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7064446 | Under bump metallization layer to enable use of high tin content solder bumps | John Barnak, Ming Fang, Kevin J. Lee, Tzuen-Luh Huang, Harry Liang +3 more | 2006-06-20 |
| 6821407 | Anode and anode chamber for copper electroplating | Jonathan D. Reid, Timothy M. Archer, Thomas Tan Vu, Seshasayee Varadarajan, Jon Henri +3 more | 2004-11-23 |
| 6030514 | Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor | John A. Dunlop, Michael Goldstein, Cari H. Shim, Stephan Schittny | 2000-02-29 |
| 5513834 | Preparation of high purity elements | Alan B. I. Bollong, David Bunnell | 1996-05-07 |