DB

David Bernhard

AC Advanced Technology & Materials Co.: 24 patents #14 of 410Top 4%
UI Universität Innsbruck: 2 patents #2 of 59Top 4%
Overall (All Time): #139,004 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 25 most recent of 28 patents

Patent #TitleCo-InventorsDate
9669000 Pharmaceutical compositions comprising lignans and their derivatives for treating hyperplastic diseases Hermann Stuppner, Stefan Schwaiger, Günther Laufer 2017-06-06
9422513 Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition Melissa K. Rath, Thomas H. Baum, David W. Minsek 2016-08-23
9256134 Photoresist removal David W. Minsek, Melissa K. Rath, Thomas H. Baum 2016-02-09
9109188 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate William A. Wojtczak, Ma. Fatima Seijo, Long Nguyen 2015-08-18
8951948 Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition Melissa K. Rath, Thomas H. Baum, David W. Minsek 2015-02-10
8765804 Pharmaceutical compositions comprising lignans and their derivatives for treating hyperplastic diseases Hermann Stuppner, Stefan Schwaiger, Günther Laufer 2014-07-01
8679734 Photoresist removal David W. Minsek, Melissa K. Rath, Thomas H. Baum 2014-03-25
8338087 Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate Melissa K. Rath, David W. Minsek, Michael B. Korzenski, Thomas H. Baum 2012-12-25
8293694 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate William A. Wojtczak, Ma. Fatimo Seijo, Long Nguyen 2012-10-23
8236485 Photoresist removal David W. Minsek, Melissa Murphy, Thomas H. Baum 2012-08-07
8058219 Metals compatible post-etch photoresist remover and/or sacrificial antireflective coating etchant Melissa K. Rath, Thomas H. Baum, Ping Jiang, Renjie Zhou, Michael B. Korzenski 2011-11-15
7994108 Composition useful for removal of post-etch photoresist and bottom anti-reflection coatings David W. Minsek, Weihua Wang, Thomas H. Baum, Melissa K. Rath 2011-08-09
7888301 Resist, barc and gap fill material stripping chemical and method Yoichiro Fujita, Tomoe Miyazawa, Makoto Nakajima 2011-02-15
7678393 Mixture composition and method useful for topical and internal application Bradford Ray Duncan 2010-03-16
7662762 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates William A. Wojtczak, Ma. Fatima Seijo, Long Nguyen 2010-02-16
7605113 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate William A. Wojtczak, Ma. Fatima Seijo, Long Nguyen 2009-10-20
7300601 Passivative chemical mechanical polishing composition for copper film planarization Jun Liu, Peter Wrschka, Mackenzie King, Michael S. Darsillo, Karl E. Boggs 2007-11-27
7029373 Chemical mechanical polishing compositions for metal and associated materials and method of using same Ying Ma, William A. Wojtczak, Cary Regulski, Thomas H. Baum, Deepak Verma 2006-04-18
6967169 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate William A. Wojtczak, Ma. Fatima Seijo, Long Nguyen 2005-11-22
6896826 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate William A. Wojtczak, Ma. Fatima Seijo, Long Nguyen 2005-05-24
6849200 Composition and process for wet stripping removal of sacrificial anti-reflective material Thomas H. Baum, David W. Minsek, Melissa Murphy 2005-02-01
6800218 Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same Ying Ma, Michael Jones, Thomas H. Baum, Deepak Verma 2004-10-05
6773873 pH buffered compositions useful for cleaning residue from semiconductor substrates Ma. Fatima Seijo, William A. Wojtczak, Thomas H. Baum, David W. Minsek 2004-08-10
6755989 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate William A. Wojtczak, Ma. Fatima Seijo, Long Nguyen 2004-06-29
6692546 Chemical mechanical polishing compositions for metal and associated materials and method of using same Ying Ma, William A. Wojtczak, Cary Regulski, Thomas H. Baum, Deepak Verma 2004-02-17