Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9109188 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate | William A. Wojtczak, David Bernhard, Long Nguyen | 2015-08-18 |
| 7662762 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates | William A. Wojtczak, David Bernhard, Long Nguyen | 2010-02-16 |
| 7605113 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate | William A. Wojtczak, David Bernhard, Long Nguyen | 2009-10-20 |
| 7534752 | Post plasma ashing wafer cleaning formulation | Daniel Fine, Thomas Kloffenstein, William A. Wojtczak | 2009-05-19 |
| 6967169 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate | William A. Wojtczak, David Bernhard, Long Nguyen | 2005-11-22 |
| 6896826 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate | William A. Wojtczak, David Bernhard, Long Nguyen | 2005-05-24 |
| 6773873 | pH buffered compositions useful for cleaning residue from semiconductor substrates | William A. Wojtczak, David Bernhard, Thomas H. Baum, David W. Minsek | 2004-08-10 |
| 6755989 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate | William A. Wojtczak, David Bernhard, Long Nguyen | 2004-06-29 |
| 6660700 | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures | William A. Wojtczak, David Bernhard, Long Nguyen | 2003-12-09 |
| 6566315 | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures | William A. Wojtczak, Dave Bernhard, Long Nguyen | 2003-05-20 |
| 6344432 | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures | William A. Wojtczak, David Bernhard, Long Nguyen | 2002-02-05 |