Issued Patents All Time
Showing 25 most recent of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11530133 | Method for recovering lithium | Li-Ching Chung, Guan-You Lin, Yi Wang, Tzu-Yu Cheng, Shing Chen +2 more | 2022-12-20 |
| 10522585 | Method for manufacturing CMOS image sensor | Yi Yang, Yi-Hung Chen, Keng-Ying Liao, Yi-Jie Chen, Shih-Hsun Hsu | 2019-12-31 |
| 8654675 | Interface detection device and detection method employing the same | — | 2014-02-18 |
| 8300539 | Switching device and loopback detecting method | — | 2012-10-30 |
| 7285434 | Semiconductor package and method for manufacturing the same | Kuo-Chung Yee | 2007-10-23 |
| 7186110 | Apparatus of making wedged plates | Francis Pan, John Pan, Chih-Lung Chen | 2007-03-06 |
| 7064428 | Wafer-level package structure | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2006-06-20 |
| 6989326 | Bump manufacturing method | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more | 2006-01-24 |
| 6989299 | Method of fabricating on-chip spacers for a TFT panel | Yuan-Tung Dai, Tsung-Neng Liao | 2006-01-24 |
| 6967153 | Bump fabrication process | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-11-22 |
| 6946729 | Wafer level package structure with a heat slug | Su Tao | 2005-09-20 |
| 6927964 | Structure for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-08-09 |
| 6891274 | Under-bump-metallurgy layer for improving adhesion | William T. Chen, Ho-Ming Tong, Su Tao, Jeng-Da Wu, Chih-Huang Chang +1 more | 2005-05-10 |
| 6877653 | Method of modifying tin to lead ratio in tin-lead bump | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-04-12 |
| 6875683 | Method of forming bump | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more | 2005-04-05 |
| 6864168 | Bump and fabricating process thereof | William T. Chen, Ho-Ming Tong, Su Tao, Chih-Huang Chang, Jeng-Da Wu +2 more | 2005-03-08 |
| 6863208 | Wire bonding process and wire bond structure | — | 2005-03-08 |
| 6861346 | Solder ball fabricating process | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more | 2005-03-01 |
| 6846719 | Process for fabricating wafer bumps | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-01-25 |
| 6827252 | Bump manufacturing method | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more | 2004-12-07 |
| 6819002 | Under-ball-metallurgy layer | William T. Chen, Ho-Ming Tong, Su Tao, Jeng-Da Wu, Chih-Huang Chang +1 more | 2004-11-16 |
| 6777309 | Method for fabricating thin film transistor display device | Tsung-Neng Liao, Yuan-Tung Dai | 2004-08-17 |
| 6756256 | Method for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2004-06-29 |
| 6743707 | Bump fabrication process | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more | 2004-06-01 |
| 6732912 | Solder ball attaching process | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2004-05-11 |