Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315802 | Method for manufacturing semiconductor package having redistribution layer | Il Hwan Kim, Un-Byoung Kang | 2022-04-26 |
| 10957833 | Light emitting diode display device | Tan Sakong, Yong-Il Kim, Han Kyu Seong, Ji Hye Yeon, Ji Hwan Hwang | 2021-03-23 |
| 9343432 | Semiconductor chip stack having improved encapsulation | Jung-Hwan Kim, Tae Hong Kim, Hyun-Jung Song, Sun-Pil Youn | 2016-05-17 |
| 8791562 | Stack package and semiconductor package including the same | Jung-Hwan Kim, Yun-Hyeok Im, Ji Hwan Hwang, Hyon-chol Kim, Kwang-chul Choi +2 more | 2014-07-29 |
| 8604615 | Semiconductor device including a stack of semiconductor chips, underfill material and molding material | Jung-Hwan Kim, Tae Hong Min, Hyun-Jung Song, Sun-Pil Youn | 2013-12-10 |
| 8250750 | Method for manufacturing tape wiring board | Kyoung-Sei Choi, Sa-Yoon Kang, Yong-Hwan Kwon | 2012-08-28 |
| 8114701 | Camera modules and methods of fabricating the same | Woon-Seong Kwon, Tae-Je Cho, Yong-Hwan Kwon, Un-Byoung Kang, Hyung-Sun Jang | 2012-02-14 |
| 7948555 | Camera module and electronic apparatus having the same | Yong-Hwan Kwon, Un-Byoung Kang, Woon-Seong Kwon, Hyung-Sun Jang | 2011-05-24 |
| 7895742 | Method for manufacturing tape wiring board | Kyoung-Sei Choi, Sa-Yoon Kang, Yong-Hwan Kwon | 2011-03-01 |
| 7893514 | Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package | Woon-Seong Kwon, Yong-Hwan Kwon, Un-Byoung Kang, Hyung-Sun Jang | 2011-02-22 |
| 7884392 | Image sensor having through via | Hyuek Jae Lee, Tae-Je Cho, Yong-Hwan Kwon, Un-Byoung Kang, Woon-Seong Kwon +1 more | 2011-02-08 |
| 7786581 | Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device | Un-Byoung Kang, Yong-Hwan Kwon, Woon-Seong Kwon, Hyung-Sun Jang | 2010-08-31 |
| 7619315 | Stack type semiconductor chip package having different type of chips and fabrication method thereof | Woon-Seong Kwon, Yong-Hwan Kwon, Un-Byoung Kang, Hyung-Sun Jang | 2009-11-17 |
| 7569423 | Wafer-level-chip-scale package and method of fabrication | Yong-Hwan Kwon, Woon-byung Kang | 2009-08-04 |
| 7554201 | Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same | Uu-Byung Kang, Yong-Hwan Kwon, Jong Ho Lee | 2009-06-30 |
| 7299547 | Method for manufacturing tape wiring board | Kyoung-Sei Choi, Sa-Yoon Kang, Yong-Hwan Kwon | 2007-11-27 |
| 7190073 | Circuit film with bump, film package using the same, and related fabrication methods | Yong-Hwan Kwon, Sa-Yoon Kang, Kyoung-Sei Choi | 2007-03-13 |
| 7087987 | Tape circuit substrate and semiconductor chip package using the same | Ye-Chung Chung | 2006-08-08 |
| 7078331 | Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same | Yong-Hwan Kwon, Sa-Yoon Kang | 2006-07-18 |