Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388032 | Semiconductor device with redistribution layers formed utilizing dummy substrates | Jin Young Kim, Ji Young Chung, Doo Hyun Park | 2025-08-12 |
| 12362343 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne | 2025-07-15 |
| 12211808 | Semiconductor device and method of forming discrete antenna modules | HunTeak Lee, Junho Ye | 2025-01-28 |
| 11855023 | Wafer level fan out semiconductor device and manufacturing method thereof | Boo Yang Jung, Jong Sik Paek, In Bae Park, Sang Won Kim, Sung Kyu Kim +1 more | 2023-12-26 |
| 11735539 | Semiconductor device and method of forming discrete antenna modules | HunTeak Lee, Junho Ye | 2023-08-22 |
| 11600582 | Semiconductor device with redistribution layers formed utilizing dummy substrates | Jin Young Kim, Ji Young Chung, Doo Hyun Park | 2023-03-07 |
| 11183493 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne | 2021-11-23 |
| 10903181 | Wafer level fan out semiconductor device and manufacturing method thereof | Boo Yang Jung, Jong Sik Paek, In Bae Park, Sang Won Kim, Sung Kyu Kim +1 more | 2021-01-26 |
| 10707181 | Semiconductor device with redistribution layers formed utilizing dummy substrates | Jin Young Kim, Ji Young Chung, Doo Hyun Park | 2020-07-07 |
| 10388643 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne | 2019-08-20 |
| 10177117 | Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure | Won Bae Bang, Ju Hoon Yoon, Ji Young Chung, Byong Jin Kim, Gi Jeong Kim | 2019-01-08 |
| 10115705 | Semiconductor package and manufacturing method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Jin Han Kim, Seung Jae Lee +3 more | 2018-10-30 |
| 9748154 | Wafer level fan out semiconductor device and manufacturing method thereof | Boo Yang Jung, Jong Sik Paek, In Bae Park, Sang Won Kim, Sung Kyu Kim +1 more | 2017-08-29 |
| 9627368 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne | 2017-04-18 |
| 9627348 | Laser assisted bonding for semiconductor die interconnections | Dong Su Ryu, Min Ho Kim, Choong Hoe Kim, Ju Hoon Yoon, Chan Ha Hwang +1 more | 2017-04-18 |
| 9412729 | Semiconductor package and fabricating method thereof | Ji Young Chung, Glenn Rinne, Byong Jin Kim | 2016-08-09 |
| 9406639 | Semiconductor package and manufacturing method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Jin Han Kim, Seung Jae Lee +3 more | 2016-08-02 |
| 8802494 | Method of fabricating a semiconductor device having an interposer | Ki Cheol BAE, Do Hyun Na | 2014-08-12 |
| 8183678 | Semiconductor device having an interposer | Ki Cheol BAE, Do Hyun Na | 2012-05-22 |
| 7837120 | Modular memory card and method of making same | Sang Jae Jang, Chul-Woo Park | 2010-11-23 |
| 7719845 | Chamfered memory card module and method of making same | Sang Jae Jang, Chul-Woo Park, Jae Dong Kim | 2010-05-18 |
| 7633763 | Double mold memory card and its manufacturing method | Chul-Woo Park, Suk Gu Ko, Sang Jae Jang, Sung Su Park | 2009-12-15 |
| 7375975 | Enhanced durability memory card | Sang Jae Jang, Chul-Woo Park | 2008-05-20 |
| 7362038 | Surface acoustic wave (SAW) device package and method for packaging a SAW device | Ho-cheol Jang, Seong Min Seo | 2008-04-22 |
| 7359204 | Multiple cover memory card | Sang Jae Jang, Chul-Woo Park, Jong Woon Choi, Jae Dong Kim, Chang Deok Lee | 2008-04-15 |