| 12300679 |
Semiconductor package structure |
Yi-Jyun Lee, Duen-Yi Ho, Hsing-Chih Liu |
2025-05-13 |
| 12230622 |
Electronic device with stacked printed circuit boards |
Ya-Lun Yang, Wen-Chou Wu |
2025-02-18 |
| 12230560 |
Semiconductor package structure |
Hsing-Chih Liu, Tai-Yu Chen |
2025-02-18 |
| 12165961 |
Semiconductor package structure |
Hsing-Chih Liu, Zheng Zeng |
2024-12-10 |
| 12021013 |
Ball pad design for semiconductor packages |
Chiang-Lin Yen |
2024-06-25 |
| 11908767 |
Semiconductor package structure |
Hsing-Chih Liu, Chia-Hao Hsu |
2024-02-20 |
| 11908759 |
Semiconductor device |
Nan-Cheng Chen, Che-Ya Chou, Hsing-Chih Liu |
2024-02-20 |
| 11887976 |
Land-side silicon capacitor design and semiconductor package using the same |
Yi-Jyun Lee |
2024-01-30 |
| 11776899 |
Via array design for multi-layer redistribution circuit structure |
Hsing-Chih Liu |
2023-10-03 |
| 11721882 |
Semiconductor package having discrete antenna device |
Fu-Yi Han, Che-Ya Chou, Wen-Chou Wu, Nan-Cheng Chen, Min-Chen Lin +1 more |
2023-08-08 |
| 11710688 |
Semiconductor package structure |
Hsing-Chih Liu, Zheng Zeng |
2023-07-25 |
| 10847869 |
Semiconductor package having discrete antenna device |
Fu-Yi Han, Che-Ya Chou, Wen-Chou Wu, Nan-Cheng Chen, Min-Chen Lin +1 more |
2020-11-24 |
| 10636773 |
Semiconductor package structure and method for forming the same |
Che-Ya Chou |
2020-04-28 |
| 10497678 |
Semiconductor package assembly with passive device |
Ying-Chih Chen, Che-Ya Chou |
2019-12-03 |
| 10468341 |
Semiconductor package assembly |
Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Ya Chou, Wei-Che Huang |
2019-11-05 |
| 10199318 |
Semiconductor package assembly |
Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Ya Chou, Wei-Che Huang |
2019-02-05 |
| 9818727 |
Semiconductor package assembly with passive device |
Ying-Chih Chen, Che-Ya Chou |
2017-11-14 |