Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7951646 | Solder ball landpad design to improve laminate performance | Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more | 2011-05-31 |
| 7335571 | Method of making a semiconductor device having an opening in a solder mask | Matt E. Schwab | 2008-02-26 |
| 7307850 | Soldermask opening to prevent delamination | — | 2007-12-11 |
| 7263768 | Method of making a semiconductor device having an opening in a solder mask | Matt E. Schwab | 2007-09-04 |
| 7255273 | Descriptor for identifying a defective die site | — | 2007-08-14 |
| 7146720 | Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial | Matt E. Schwab | 2006-12-12 |
| 7127365 | Method for identifying a defective die site | — | 2006-10-24 |
| 7115819 | Positioning flowable solder for bonding integrated circuit elements | — | 2006-10-03 |
| 7088590 | Soldermask opening to prevent delamination | — | 2006-08-08 |
| 7019223 | Solder resist opening to define a combination pin one indicator and fiducial | Matt E. Schwab | 2006-03-28 |
| 7013559 | Method of fabricating a semiconductor device package | Matt E. Schwab | 2006-03-21 |
| 6984894 | Semiconductor package having a partial slot cover for encapsulation process | — | 2006-01-10 |
| 6914326 | Solder ball landpad design to improve laminate performance | Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more | 2005-07-05 |
| 6889902 | Descriptor for identifying a defective die site and methods of formation | — | 2005-05-10 |
| 6790708 | Encapsulation process using a partial slot cover and a package formed by the process | — | 2004-09-14 |
| 6734372 | Gate area relief strip for a molded I/C package | Stephen James, Richard W. Wensel | 2004-05-11 |
| 6690086 | Apparatus and method for reducing interposer compression during molding process | Stephen James | 2004-02-10 |
| 6671182 | Soldermask opening to prevent delamination | — | 2003-12-30 |
| 6668449 | Method of making a semiconductor device having an opening in a solder mask | Matt E. Schwab | 2003-12-30 |
| 6644949 | Apparatus for reduced flash encapsulation of microelectronic devices | Todd O. Bolken, Cary J. Baerlocher | 2003-11-11 |
| 6638595 | Method and apparatus for reduced flash encapsulation of microelectronic devices | Todd O. Bolken, Cary J. Baerlocher | 2003-10-28 |
| 6634099 | Soldermask opening to prevent delamination | — | 2003-10-21 |
| 6577015 | Partial slot cover for encapsulation process | — | 2003-06-10 |
| 6577004 | Solder ball landpad design to improve laminate performance | Patrick W. Tandy, William Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more | 2003-06-10 |
| 6521980 | Controlling packaging encapsulant leakage | Patrick W. Tandy, Joseph Brand, Steven R. Stephenson, David J. Corisis, Todd O. Bolken +2 more | 2003-02-18 |