Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109587 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Byung Tai Do, Kyung-Moon Kim, Jeffrey D. Punzalan, SeungYong Chai +3 more | 2018-10-23 |
| 9865554 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, Kyung-Moon Kim, HeeJo Chi, JunMo Koo, Zigmund Ramirez Camacho | 2018-01-09 |
| 9679769 | Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof | Zigmund Ramirez Camacho, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi | 2017-06-13 |
| 9659897 | Integrated circuit packaging system with interposer structure and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan | 2017-05-23 |
| 9502267 | Integrated circuit packaging system with support structure and method of manufacture thereof | HeeJo Chi, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong | 2016-11-22 |
| 9412624 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Byung Tai Do, Kyung-Moon Kim, Jeffrey D. Punzalan, SeungYong Chai +3 more | 2016-08-09 |
| 9406531 | Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof | Zigmund Ramirez Camacho, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi | 2016-08-02 |
| 9406642 | Integrated circuit packaging system with insulated trace and method of manufacture thereof | HeeJo Chi, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong | 2016-08-02 |
| 9355983 | Integrated circuit packaging system with interposer structure and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan | 2016-05-31 |
| 9331003 | Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof | Zigmund Ramirez Camacho, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi | 2016-05-03 |