Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7374971 | Semiconductor die edge reconditioning | Yuan Yuan, Kevin J. Hess, Chu-Chung Lee, Tu-Anh N. Tran | 2008-05-20 |
| 7105383 | Packaged semiconductor with coated leads and method therefore | Nhat Vo | 2006-09-12 |
| 7015585 | Packaged integrated circuit having wire bonds and method therefor | Susan H. Downey, Sheila F. Chopin, Peter R. Harper, Sohrab Safai, Tu-Anh N. Tran | 2006-03-21 |
| 6998952 | Inductive device including bond wires | Yaping Zhou, Susan H. Downey, Sheila F. Chopin, Tu-Anh N. Tran, Peter R. Harper +1 more | 2006-02-14 |
| 5708300 | Semiconductor device having contoured package body profile | Everitt W. Mace | 1998-01-13 |
| 5656549 | Method of packaging a semiconductor device | Harold Downey, Everitt W. Mace | 1997-08-12 |
| 5517056 | Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same | Charles G. Bigler, Michael B. McShane | 1996-05-14 |
| 5344600 | Method for encapsulating semiconductor devices with package bodies | Michael B. McShane, Francis Primeaux | 1994-09-06 |
| 5233222 | Semiconductor device having window-frame flag with tapered edge in opening | Frank Djennas | 1993-08-03 |
| 4434360 | Optical sensing device for reading bar code or the like | Billy R. Masten | 1984-02-28 |