Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211863 | Reliable semiconductor packages | Il Kwon Shim, Jeffrey D. Punzalan, Emmanuel Espiritu, Teddy Joaquin Carreon | 2025-01-28 |
| 12021096 | Reliable semiconductor packages | Dennis Fernandez Tresnado, Mario Arwin Simon Fabian, Wedanni Linsangan Micla | 2024-06-25 |
| 9305809 | Integrated circuit packaging system with coreless substrate and method of manufacture thereof | Emmanuel Espiritu, Jeffrey D. Punzalan | 2016-04-05 |
| 9048228 | Integrated circuit packaging system with side solderable leads and method of manufacture thereof | Byung Tai Do, Emmanuel Espiritu, Marites Roque | 2015-06-02 |
| 8395254 | Integrated circuit package system with heatspreader | Emmanuel Espiritu, Dario S. Filoteo, Jr., Leo A. Merilo, Philip Lyndon Cablao, Rachel Layda Abinan | 2013-03-12 |
| 8304921 | Integrated circuit packaging system with interconnect and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Philip Lyndon Cablao | 2012-11-06 |
| 8138080 | Integrated circuit package system having interconnect stack and external interconnect | Dario S. Filoteo, Jr., Leo A. Merilo, Philip Lyndon Cablao, Emmanuel Espiritu, Rachel Layda Abinan | 2012-03-20 |
| 8026129 | Stacked integrated circuits package system with passive components | Philip Lyndon Cablao, Dario S. Filoteo, Jr., Leo A. Merilo, Emmanuel Espiritu, Rachel Layda Abinan | 2011-09-27 |
| 7911046 | Integrated circuit packaging system with interposer | Philip Lyndon Cablao, Rachel Layda Abinan, Dario S. Filoteo, Jr. | 2011-03-22 |
| 7518226 | Integrated circuit packaging system with interposer | Philip Lyndon Cablao, Rachel Layda Abinan, Dario S. Filoteo, Jr. | 2009-04-14 |