Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9294035 | Multigate resonant channel transistor | Sasikanth Manipatruni, Raseong Kim, Rajeev Kumar Dokania, Ian A. Young | 2016-03-22 |
| 9196752 | Backside bulk silicon MEMS | Christopher M. Pelto | 2015-11-24 |
| 9061890 | Methods of forming buried electromechanical structures coupled with device substrates and structures formed thereby | — | 2015-06-23 |
| 8541876 | Microelectronic package having direct contact heat spreader and method of manufacturing same | Daoqiang Lu, Chuan Hu, Gilroy Vandentop, Shriram Ramanathan, Valery M. Dubin | 2013-09-24 |
| 7902617 | Forming a thin film electric cooler and structures formed thereby | — | 2011-03-08 |
| 7875934 | Semiconductor substrate with islands of diamond and resulting devices | Kramadhati V. Ravi | 2011-01-25 |
| 7833816 | Forming a thin film thermoelectric cooler and structures formed thereby | — | 2010-11-16 |
| 7821073 | Patterned backside stress engineering for transistor performance optimization | Gilroy Vandentop | 2010-10-26 |
| 7723759 | Stacked wafer or die packaging with enhanced thermal and device performance | Shriram Ramanathan, Patrick Morrow | 2010-05-25 |
| 7666714 | Assembly of thin die coreless package | Daoqiang Lu, Charan Gurumurthy | 2010-02-23 |
| 7557438 | Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same | Gregory M. Chrysler | 2009-07-07 |
| 7517228 | Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit | Henning Braunisch | 2009-04-14 |
| 7476568 | Wafer-level assembly of heat spreaders for dual IHS packages | Daoqiang Lu, Chuan Hu | 2009-01-13 |
| 7449361 | Semiconductor substrate with islands of diamond and resulting devices | Kramadhati V. Ravi | 2008-11-11 |
| 7371630 | Patterned backside stress engineering for transistor performance optimization | Gilroy Vandentop | 2008-05-13 |