Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7098047 | Wafer reuse techniques | — | 2006-08-29 |
| 7071552 | IC die with directly bonded liquid cooling device | Ravi Prasher, Gregory M. Chrysler | 2006-07-04 |
| 7041993 | Protective coatings for radiation source components | Manish Chandhok, Robert L. Bristol, Melissa Shell | 2006-05-09 |
| 6987028 | Method of fabricating a microelectronic die | — | 2006-01-17 |
| 6982133 | Damage-resistant coatings for EUV lithography components | Manish Chandhok | 2006-01-03 |
| 6964880 | Methods for the control of flatness and electron mobility of diamond coated silicon and structures formed thereby | — | 2005-11-15 |
| 6940096 | Double gate field effect transistor with diamond film | — | 2005-09-06 |
| 6936497 | Method of forming electronic dies wherein each die has a layer of solid diamond | Gregory M. Chrysler | 2005-08-30 |
| 6924170 | Diamond-silicon hybrid integrated heat spreader | James G. Maveety | 2005-08-02 |
| 6921706 | Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat | Gregory M. Chrysler, Abhay Watwe, Sairam Agraharam, Michael C. Garner | 2005-07-26 |
| 6847044 | Electrical discharge gas plasma EUV source insulator components | Bryan Rice | 2005-01-25 |
| 6830813 | Stress-reducing structure for electronic devices | — | 2004-12-14 |
| 6809328 | Protective coatings for radiation source components | Manish Chandhok, Robert L. Bristol, Melissa Shell | 2004-10-26 |
| 6770966 | Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat | Gregory M. Chrysler, Abhay Watwe, Sairam Agraharam, Michael C. Garner | 2004-08-03 |
| 6743697 | Thin silicon circuits and method for making the same | — | 2004-06-01 |
| 6730972 | Amorphous carbon insulation and carbon nanotube wires | Eric C. Hannah | 2004-05-04 |
| 6706981 | Techniques to fabricate a reliable opposing contact structure | Qing Ma, Valluri Rao | 2004-03-16 |
| 6667522 | Silicon wafers for CMOS and other integrated circuits | Li Ling, Sing-Chung Hu | 2003-12-23 |
| 6621022 | Reliable opposing contact structure | Qing Ma, Valluri Rao | 2003-09-16 |
| 6548313 | Amorphous carbon insulation and carbon nanotube wires | Eric C. Hannah | 2003-04-15 |
| 6423615 | Silicon wafers for CMOS and other integrated circuits | Li Ling, Sing-Chung Hu | 2002-07-23 |
| 6406981 | Method for the manufacture of semiconductor devices and circuits | — | 2002-06-18 |
| 6387572 | Low CTE substrate for reflective EUV lithography | Tom X. Tong | 2002-05-14 |
| 6238482 | Method of producing a wafer with an epitaxial quality layer and device with epitaxial quality layer | Brian S. Doyle | 2001-05-29 |
| 6132517 | Multiple substrate processing apparatus for enhanced throughput | Visweswaren Sivaramakrishnan, Tirunelveli S. Ravi | 2000-10-17 |