Issued Patents All Time
Showing 26–50 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734318 | Folded semiconductor package architectures and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Yun Rou Lim | 2020-08-04 |
| 10734333 | Semiconductor package having inductive lateral interconnects | Jackson Chung Peng Kong, Bok Eng Cheah, Howard L. Heck | 2020-08-04 |
| 10716209 | Fiber weave-sandwiched differential pair routing technique | Bok Eng Cheah, Eng Huat Goh, Jackson Chung Peng Kong, Min Suet Lim | 2020-07-14 |
| 10701796 | Electromagnetic interference (EMI) shield | Tin Poay Chuah, Yew San Lim, Khai Ern See, Kevin Byrd | 2020-06-30 |
| 10652999 | Mutual inductance suppressor for crosstalk immunity enhancement | Jackson Chung Peng Kong, Bok Eng Cheah, Stephen H. Hall | 2020-05-12 |
| 10643983 | Extended stiffener for platform miniaturization | Eng Huat Goh, Bok Eng Cheah, Jackson Chung Peng Kong, Min Suet Lim, Howe Yin Loo | 2020-05-05 |
| 10609813 | Capacitive interconnect in a semiconductor package | Eng Huat Goh, Min Suet Lim, Fern Nee Tan, Jiun Hann Sir | 2020-03-31 |
| 10516366 | Crystal oscillator interconnect architecture with noise immunity | Raymond Chong, Ramaswamy Parthasarathy, Stephen H. Hall, Chin Lee Kuan | 2019-12-24 |
| 10484231 | Routing-over-void-T-line-compensation | Bok Eng Cheah, Jackson Chung Peng Kong, Stephen H. Hall, Yun Rou Lim | 2019-11-19 |
| 10396834 | Apparatus and method for adaptive common mode noise decomposition and tuning | Boon Ping Koh, Amit Kumar Srivastava, Wil Choon Song | 2019-08-27 |
| 10388636 | Integrating system in package (SIP) with input/output (IO) board for platform miniaturization | Eng Huat Goh, Wee Hoe, Ping Ping Ooi | 2019-08-20 |
| 10386941 | Gyratory sensing system to enhance wearable device user experience via HMI extension | Wil Choon Song, Howard L. Heck, Su Sin Florence Phun | 2019-08-20 |
| 10354957 | Electrical interconnect for a flexible electronic package | Bok Eng Cheah, Jackson Chung Peng Kong, Stephen H. Hall, Kooi Chi Ooi, Eric C Gantner | 2019-07-16 |
| 10356902 | Board to board interconnect | Chee Ling Wong, Wil Choon Song, Eng Huat Goh, Mohd Muhaiyiddin Bin Abdullah, Tin Poay Chuah | 2019-07-16 |
| 10256519 | Stranded transmission line and uses thereof | Wil Choon Song, Min Suet Lim, Eng Huat Goh, Boon Ping Koh | 2019-04-09 |
| 10171033 | Crystal oscillator interconnect architecture with noise immunity | Raymond Chong, Ramaswamy Parthasarathy, Stephen H. Hall, Chin Lee Kuan | 2019-01-01 |
| 10158339 | Capacitive compensation structures using partially meshed ground planes | Jackson Chung Peng Kong, Bok Eng Cheah, Howard L. Heck, Wil Choon Song | 2018-12-18 |
| 10153253 | Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus | Howe Yin Loo, Eng Huat Goh, Min Suet Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2018-12-11 |
| 10108227 | Techniques for providing an interface component for a wearable device | Shu Young Cheah, Wil Choon Song, Jackson Chung Peng Kong, Howard L. Heck | 2018-10-23 |
| 10083922 | Inductor interconnect | Min Suet Lim, Chin Lee Kuan, Eng Huat Goh, Bok Eng Cheah, Jackson Chung Peng Kong +1 more | 2018-09-25 |
| 10085342 | Microelectronic device having an air core inductor | Bok Eng Cheah, Jackson Chung Peng Kong, Min Suet Lim, Chin Lee Kuan, Howe Yin Loo | 2018-09-25 |
| 10079158 | Vertical trench routing in a substrate | Jackson Chung Peng Kong, Bok Eng Cheah, Howard L. Heck, Kuan-Yu Chen | 2018-09-18 |
| 9893444 | Board-edge interconnection module with integrated capacitive coupling for enabling ultra-mobile computing devices | Jackson Chung Peng Kong, Eng Huat Goh, Bok Eng Cheah, Su Sin Florence Phun, Min Keen Tang | 2018-02-13 |
| 9836095 | Microelectronic device package electromagnetic shield | Min Suet Lim, Eng Huat Goh, Boon Ping Koh, Wil Choon Song | 2017-12-05 |
| D788626 | Smartwatch | Wil Choon Song, Su Sin Florence Phun, Poh Tat Oh | 2017-06-06 |