Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402349 | Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Kinyip Phoa, Oleg Golonzka +5 more | 2025-08-26 |
| 12328947 | Substrate-less silicon controlled rectifier (SCR) integrated circuit structures | Rui Ma, Nicholas A. Thomson, Ayan Kar, Benjamin Orr, Nathan Jack +3 more | 2025-06-10 |
| 12317590 | Substrate-free integrated circuit structures | Biswajeet Guha, Brian J. Greene, Avyaya Jayanthinarasimham, Ayan Kar, Benjamin Orr +9 more | 2025-05-27 |
| 12294003 | Integrated circuit structures including backside vias | Nicholas A. Thomson, Adam Clay Faust, Frank O'Mahony, Ayan Kar, Rui Ma | 2025-05-06 |
| 12288789 | Gate-all-around integrated circuit structures having devices with source/drain-to-substrate electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Kinyip Phoa, Oleg Golonzka +5 more | 2025-04-29 |
| 11908856 | Gate-all-around integrated circuit structures having devices with source/drain-to-substrate electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Kinyip Phoa, Oleg Golonzka +5 more | 2024-02-20 |
| 11869987 | Gate-all-around integrated circuit structures including varactors | Ayan Kar, Saurabh Morarka, Carlos Nieva-Lozano, Biswajeet Guha, Chung-Hsun Lin +2 more | 2024-01-09 |
| 11837641 | Gate-all-around integrated circuit structures having adjacent deep via substrate contacts for sub-fin electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Kinyip Phoa, Oleg Golonzka +5 more | 2023-12-05 |
| 11824116 | Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Kinyip Phoa, Oleg Golonzka +5 more | 2023-11-21 |
| 11791331 | Integrated circuit structures including backside vias | Nicholas A. Thomson, Adam Clay Faust, Frank O'Mahony, Ayan Kar, Rui Ma | 2023-10-17 |
| 11652107 | Substrate-less FinFET diode architectures with backside metal contact and subfin regions | Nicholas A. Thomson, Ayan Kar, Nathan Jack, Rui Ma, Mark Bohr +2 more | 2023-05-16 |
| 11417781 | Gate-all-around integrated circuit structures including varactors | Ayan Kar, Saurabh Morarka, Carlos Nieva-Lozano, Biswajeet Guha, Chung-Hsun Lin +2 more | 2022-08-16 |
| 11145732 | Field-effect transistors with dual thickness gate dielectrics | Ayan Kar, Nicholas A. Thomson, Mark Armstrong, Sameer Jayanta Joglekar, Rui Ma +3 more | 2021-10-12 |
| 10249597 | Systems, methods, and apparatuses for implementing die recovery in two-level memory (2LM) stacked die subsystems | Lakshminarayana Pappu, Pete D. Vogt, Christopher J. Nelson, Amande B. Trang, Uddalak Bhattacharya | 2019-04-02 |
| 9891269 | Pulsed testing of through-body-vias | Mladenko Vukic | 2018-02-13 |
| 9513330 | Charge sharing testing of through-body-vias | Mladenko Vukic | 2016-12-06 |