Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815256 | Silicon building blocks in integrated circuit packaging | Dong Zhong, Yuan-Liang Li, Jiangqi He, Cengiz A. Palanduz | 2004-11-09 |
| 6811410 | Integrated circuit socket with capacitors and shunts | Yuan-Liang Li | 2004-11-02 |
| 6784532 | Power/ground configuration for low impedance integrated circuit | Dong Zhong, Farzaneh Yahyaei-Moayyed, Chris Baldwin, Jiangqi He, Yuan-Liang Li | 2004-08-31 |
| 6780057 | Coaxial dual pin sockets for high speed I/O applications | Yuan-Liang Li | 2004-08-24 |
| 6775150 | Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture | Kishore K. Chakravorty, Paul H. Wermer, Debabrata Gupta | 2004-08-10 |
| 6717277 | Electrical assembly with vertical multiple layer structure | Chee-Yee Chung, Robert L. Sankman | 2004-04-06 |
| 6680526 | Socket with low inductance side contacts for a microelectronic device package | Yuan-Liang Li | 2004-01-20 |
| 6680218 | Fabrication method for vertical electronic circuit package and system | Chee-Yee Chung, Robert L. Sankman | 2004-01-20 |
| 6672912 | Discrete device socket and method of fabrication therefor | — | 2004-01-06 |
| 6657275 | Pad and via placement design for land side capacitors | Chee-Yee Chung, Yuan-Liang Li | 2003-12-02 |
| 6606237 | Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same | Yasuyuki Naito, Masaaki Taniguchi, Yoichi Kuroda, Haruo Hori, Jorge P. Rodriguez +3 more | 2003-08-12 |
| 6584685 | System and method for package socket with embedded power and ground planes | Chee-Yee Chung, Kris Frutschy, Bob Sankman, Farzaneh Yahyaei-Moayyed | 2003-07-01 |
| 6558169 | Shunt power connection for an integrated circuit package | Yuan-Liang Li, Hong Xie | 2003-05-06 |
| 6558181 | System and method for package socket with embedded power and ground planes | Chee-Yee Chung, Kris Frutschy, Bob Sankman, Farzaneh Yahyaei-Moayyed | 2003-05-06 |
| 6559484 | Embedded enclosure for effective electromagnetic radiation reduction | Yuan-Liang Li, Chee-Yee Chung | 2003-05-06 |
| 6556453 | Electronic circuit housing with trench vias and method of fabrication therefor | Nicholas R. Watts | 2003-04-29 |
| 6555920 | Vertical electronic circuit package | Chee-Yee Chung, Robert L. Sankman | 2003-04-29 |
| 6545346 | Integrated circuit package with a capacitor | Debendra Mallik, Jorge P. Rodriguez | 2003-04-08 |
| 6532143 | Multiple tier array capacitor | Kishore K. Chakravorty, Huong Do, Larry E. Mosley, Jorge P. Rodriguez, Ken Brown | 2003-03-11 |
| 6519134 | Universal capacitor terminal design | Yuan-Liang Li | 2003-02-11 |
| 6509640 | Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction | Yuan-Liang Li, Chee-Yee Chung | 2003-01-21 |
| 6495770 | Electronic assembly providing shunting of electrical current | Yuan-Liang Li, Priyavadan R. Patel | 2002-12-17 |
| 6493861 | Interconnected series of plated through hole vias and method of fabrication therefor | Yuan-Liang Li | 2002-12-10 |
| 6483692 | Capacitor with extended surface lands and method of fabrication therefor | Huong Do, Jorge P. Rodriguez, Michael Walk | 2002-11-19 |
| 6476477 | Electronic assembly providing shunting of electrical current | Yuan-Liang Li, Priyavadan R. Patel | 2002-11-05 |