Issued Patents All Time
Showing 76–91 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7193263 | Electronic component having an integrated passive electronic component and associated production method | — | 2007-03-20 |
| 6960835 | Stress-relief layer for semiconductor applications | Erdem Kaltalioglu, Mark Hoinkis, Gerald Friese, Pak K. Leung | 2005-11-01 |
| 6949442 | Methods of forming MIM capacitors | Petra Felsner, Erdem Kaltalioglu, Gerald Friese | 2005-09-27 |
| 6908841 | Support structures for wirebond regions of contact pads over low modulus materials | Lloyd Burrell, Douglas W. Kemerer, Henry A. Nye, III, Emmanuel F. Crabbe, David F. Anderson +1 more | 2005-06-21 |
| 6893959 | Method to form selective cap layers on metal features with narrow spaces | — | 2005-05-17 |
| 6866943 | Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level | Gerald Friese, Werner Robl, Axel Brintzinger | 2005-03-15 |
| 6844245 | Method of preparing a self-passivating Cu laser fuse | — | 2005-01-18 |
| 6750129 | Process for forming fusible links | Gwo-Shii Yang, Jen-Kon Chen, Hsueh-Chung Chen, Chiung-Sheng Hsiung, Chih-Chien Liu +3 more | 2004-06-15 |
| 6730982 | FBEOL process for Cu metallizations free from Al-wirebond pads | Petra Felsner, Erdem Kaltalioglu, Gerald Friese | 2004-05-04 |
| 6693343 | Self-passivating Cu laser fuse | — | 2004-02-17 |
| 6559042 | Process for forming fusible links | Lloyd Burrell, Gerald Friese, Michael Stetter | 2003-05-06 |
| 6515373 | Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys | — | 2003-02-04 |
| 6451664 | Method of making a MIM capacitor with self-passivating plates | Gerald Friese, Petra Felsner | 2002-09-17 |
| PP10725 | Echinodorus plant named `Red Flame` | — | 1998-12-15 |
| PP10726 | Echinodorus plant named `Indian Red` | — | 1998-12-15 |
| 4766296 | Article checkout counter and system | — | 1988-08-23 |