SO

Stefano S. Oggioni

IBM: 104 patents #521 of 70,183Top 1%
Overall (All Time): #13,477 of 4,157,543Top 1%
104
Patents All Time

Issued Patents All Time

Showing 76–100 of 104 patents

Patent #TitleCo-InventorsDate
7491068 Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2009-02-17
7491067 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2009-02-17
7488182 Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2009-02-10
7484966 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2009-02-03
7467951 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2008-12-23
7462039 LGA utilizing metal-on-elastomer hemi-torus having a slitted wall surface for venting gases Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2008-12-09
7458817 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2008-12-02
7402052 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2008-07-22
7389012 Electro-optical module comprising flexible connection cable and method of making the same Bert Jan Offrein 2008-06-17
7382946 Electro-optical module comprising flexible connection cable and method of making the same Bert Jan Offrein 2008-06-03
7381063 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2008-06-03
7377790 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2008-05-27
7374428 Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2008-05-20
7360308 Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers Gianluca Rogiani, Mauro Spreafico, Giorgio Viero 2008-04-22
7361025 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2008-04-22
7361026 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2008-04-22
7361024 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2008-04-22
7354277 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2008-04-08
7331796 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas 2008-02-19
7319197 Structure of stacked vias in multiple layer electrode device carriers Michele Castriotta, Gianluca Rogiani, Mauro Spreafico, Giorgio Viero 2008-01-15
7091424 Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers Gianluca Rogiani, Mauro Spreafico, Giorgio Viero 2006-08-15
7070085 Water soluble protective paste for manufacturing printed circuit boards 2006-07-04
7015574 Electronic device carrier adapted for transmitting high frequency signals David J. Alcoe, Ronald Peter Nowak, Francesco Preda 2006-03-21
6777817 Reworkable and thermally conductive adhesive and use thereof Stephen L. Buchwalter, Michael A. Gaynes, Nancy C. LaBianca, Son K. Tran 2004-08-17
6717255 Chip carrier for a high-frequency electronic package Roberto Ravanelli 2004-04-06