Issued Patents All Time
Showing 51–75 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8444328 | Electro-optical assembly fabrication | Jonas R. Weiss, Bert Jan Offrein | 2013-05-21 |
| 8355259 | Demountable dry connection for flexible circuits to circuit boards | Christoph Berger, Laurent A. Dellmann | 2013-01-15 |
| 8341834 | Method of producing a land grid array (LGA) interposer structure | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2013-01-01 |
| 8316540 | Method of producing a land grid array (LGA) interposer structure | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2012-11-27 |
| 8286345 | Method for attaching a flexible structure to a device | Roger F. Dangel, Laurent A. Dellmann, Michel Despont, Bert Jan Offrein | 2012-10-16 |
| 8191245 | Method of forming a land grid array (LGA) interposer | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2012-06-05 |
| 8171630 | Method of producing a land grid array interposer | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2012-05-08 |
| 8136242 | Method of producing a land grid array interposer utilizing metal-on-elastomer | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2012-03-20 |
| 8037600 | Method of producing a land grid array interposer structure | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2011-10-18 |
| 7982475 | Structure and method for reliability evaluation of FCPBGA substrates for high power semiconductor packaging applications | David J. Russell, Ronald Malfatt, Jamil A. Wakil | 2011-07-19 |
| 7915540 | Tamper-proof structures for protecting electronic modules | — | 2011-03-29 |
| 7836585 | Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2010-11-23 |
| 7832094 | Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2010-11-16 |
| 7832095 | Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2010-11-16 |
| 7823283 | Method of forming a land grid array interposer | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2010-11-02 |
| 7788801 | Method for manufacturing a tamper-proof cap for an electronic module | Vincenzo Condorelli, Nihad Hadzic | 2010-09-07 |
| 7783998 | Method and system for prototyping electronic devices with multi-configuration CHIP carriers | — | 2010-08-24 |
| 7703201 | Method of embedding tamper proof layers and discrete components into printed circuit board stack-up | Vincenzo Condorelli, Nihad Hadzic, Kevin C. Gotze, Tamas Visegrady | 2010-04-27 |
| 7665999 | Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier plane | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2010-02-23 |
| 7658616 | Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposers | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2010-02-09 |
| 7650693 | Method of assembling electronic components of an electronic system, and system thus obtained | Bert Jan Offrein, Mauro Spreafico | 2010-01-26 |
| 7641479 | Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2010-01-05 |
| 7523547 | Method for attaching a flexible structure to a device and a device having a flexible structure | Roger F. Dangel, Laurent A. Dellmann, Michel Despont, Bert Jan Offrein | 2009-04-28 |
| 7524698 | Handling and positioning of metallic plated balls for socket application in ball grid array packages | Giorgio Viero, Michele Castriotta | 2009-04-28 |
| 7505284 | System for assembling electronic components of an electronic system | Bert Jan Offrein, Mauro Spreafico | 2009-03-17 |