Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10271424 | Tamper-respondent assemblies with in situ vent structure(s) | Silvio Dragone, William Santiago-Fernandez | 2019-04-23 |
| 10175064 | Circuit boards and electronic packages with embedded tamper-respondent sensor | William L. Brodsky, Silvio Dragone, Roger S. Krabbenhoft, David C. Long, Michael T. Peets +1 more | 2019-01-08 |
| 10168185 | Circuit boards and electronic packages with embedded tamper-respondent sensor | William L. Brodsky, Silvio Dragone, Roger S. Krabbenhoft, David C. Long, Michael T. Peets +1 more | 2019-01-01 |
| 10153250 | Flip-chip electronic device with carrier having heat dissipation elements free of solder mask | Thomas J. Brunschwiler, Gerd Schlottig | 2018-12-11 |
| 10098241 | Printed circuit board with edge soldering for high-density packages and assemblies | Thomas J. Brunschwiler, Andreas Doering, Ronald P. Luijten, Joerg-Eric Sagmeister, Patricia M. Sagmeister +1 more | 2018-10-09 |
| 10068839 | Circuitized substrate with electronic components mounted on transversal portion thereof | Thomas J. Brunschwiler, Sebastian Gerke | 2018-09-04 |
| 10008081 | Electronic devices with individual security circuits | Silvio Dragone, Christoph Hagleitner | 2018-06-26 |
| 10008474 | Dense assembly of laterally soldered, overmolded chip packages | Thomas J. Brunschwiler, Andreas Doering, Ronald P. Luijten, Patricia M. Sagmeister, Martin Schmatz | 2018-06-26 |
| 9980385 | Discrete electronic device embedded in chip module | Andreas Huber, Harald Huels, Thomas Strach, Thomas-Michael Winkel | 2018-05-22 |
| 9698089 | Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section | Thomas J. Brunschwiler, Dominic Gschwend, Keiji Matsumoto, Gerd Schlottig, Timo J. Tick +1 more | 2017-07-04 |
| 9673179 | Discrete electronic device embedded in chip module | Andreas Huber, Harald Huels, Thomas Strach, Thomas-Michael Winkel | 2017-06-06 |
| 9433077 | Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section | Thomas J. Brunschwiler, Dominic Gschwend, Keiji Matsumoto, Gerd Schlottig, Timo J. Tick +1 more | 2016-08-30 |
| 9397042 | Integrated helical multi-layer inductor structures | Thomas J. Brunschwiler, Michele Castriotta, Rachel Gordin, Gerd Schlottig | 2016-07-19 |
| 9323009 | Computer program product for electro-optical assembly | Jonas R. Weiss, Bert Jan Offrein | 2016-04-26 |
| 9274289 | Fabricating an optical assembly | Jonas R. Weiss, Bert Jan Offrein | 2016-03-01 |
| 9055701 | Method and system for improving alignment precision of parts in MEMS | Michel Despont, Mark A. Lantz, Thomas R. Albrecht | 2015-06-09 |
| 9055681 | Method for attaching a flexible structure to a device and a device having a flexible structure | Roger F. Dangel, Laurent A. Dellmann, Michel Despont, Bert Jan Offrein | 2015-06-09 |
| 8938627 | Multilayer securing structure and method thereof for the protection of cryptographic keys and code | Vincenzo Condorelli, Claudius Feger | 2015-01-20 |
| 8926197 | Method for fabricating an electro-optical assembly | Jonas R. Weiss, Bert Jan Offrein | 2015-01-06 |
| 8907503 | Manufacturing an underfill in a semiconductor chip package | Thomas J. Brunschwiler, Javier V. Goicochea, Gerd Schlottig | 2014-12-09 |
| 8870472 | Computer program product for electro-optical assembly | Jonas R. Weiss, Bert Jan Offrein | 2014-10-28 |
| 8752284 | Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2014-06-17 |
| 8707553 | Method and system for improving alignment precision of parts in MEMS | Michel Despont, Mark A. Lantz, Thomas R. Albrecht | 2014-04-29 |
| 8505200 | Land grid array interposer producing method | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2013-08-13 |
| 8479388 | Method of producing a land grid array interposer | Gareth G. Hougham, Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Enrique Vargas | 2013-07-09 |