Issued Patents All Time
Showing 26–50 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8853781 | Rare-earth oxide isolated semiconductor fin | Kangguo Cheng, Joseph Ervin, Chengwen Pei, Geng Wang | 2014-10-07 |
| 8846470 | Metal trench capacitor and improved isolation and methods of manufacture | Roger A. Booth, Jr., Kangguo Cheng, Joseph Ervin, Chengwen Pei, Geng Wang | 2014-09-30 |
| 8836003 | Lateral epitaxial grown SOI in deep trench structures and methods of manufacture | Joseph Ervin, Brian W. Messenger, Karen A. Nummy | 2014-09-16 |
| 8836050 | Structure and method to fabricate a body contact | Chengwen Pei, Roger A. Booth, Jr., Kangguo Cheng, Joseph Ervin, Geng Wang | 2014-09-16 |
| 8829585 | High density memory cells using lateral epitaxy | Roger A. Booth, Jr., Kangguo Cheng, Joseph Ervin, David M. Fried, Byeong Y. Kim +2 more | 2014-09-09 |
| 8809994 | Deep isolation trench structure and deep trench capacitor on a semiconductor-on-insulator substrate | Roger A. Booth, Jr., Kangguo Cheng, Joseph Ervin, Chengwen Pei, Geng Wang | 2014-08-19 |
| 8754461 | Spacer isolation in deep trench | Kangguo Cheng, Joseph Ervin, Chengwen Pei, Geng Wang | 2014-06-17 |
| 8742503 | Recessed single crystalline source and drain for semiconductor-on-insulator devices | Geng Wang, Kangguo Cheng, Joseph Ervin, Chengwen Pei | 2014-06-03 |
| 8692307 | Lateral epitaxial grown SOI in deep trench structures and methods of manufacture | Joseph Ervin, Brian W. Messenger, Karen A. Nummy | 2014-04-08 |
| 8691697 | Self-aligned devices and methods of manufacture | Roger A. Booth, Jr., Kangguo Cheng, Joseph Ervin, Chengwen Pei, Geng Wang | 2014-04-08 |
| 8647945 | Method of forming substrate contact for semiconductor on insulator (SOI) substrate | Geng Wang, Roger A. Booth, Jr., Kangguo Cheng, Joseph Ervin, Chengwen Pei | 2014-02-11 |
| 8637958 | Structure and method for forming isolation and buried plate for trench capacitor | Abhishek Dube, Subramanian S. Iyer, Babar A. Khan, Oh-Jung Kwon, Junedong Lee +4 more | 2014-01-28 |
| 8637365 | Spacer isolation in deep trench | Kangguo Cheng, Joseph Ervin, Chengwen Pei, Geng Wang | 2014-01-28 |
| 8575670 | Embedded dynamic random access memory device formed in an extremely thin semiconductor on insulator (ETSOI) substrate | Kangguo Cheng, Joseph Ervin, Chengwen Pei, Geng Wang | 2013-11-05 |
| 8564069 | Field effect transistors with low body resistance and self-balanced body potential | Roger A. Booth, Jr., Kangguo Cheng, Joseph Ervin, Chengwen Pei, Geng Wang | 2013-10-22 |
| 8455875 | Embedded DRAM for extremely thin semiconductor-on-insulator | Roger A. Booth, Jr., Kangguo Cheng, Joseph Ervin, Ali Khakifirooz, Chengwen Pei +1 more | 2013-06-04 |
| 8455979 | Three dimensional integrated deep trench decoupling capacitors | Roger A. Booth, Jr., Kangguo Cheng, Geng Wang | 2013-06-04 |
| 8409989 | Structure and method to fabricate a body contact | Chengwen Pei, Roger A. Booth, Jr., Kangguo Cheng, Joseph Ervin, Geng Wang | 2013-04-02 |
| 8372725 | Structures and methods of forming pre fabricated deep trench capacitors for SOI substrates | Robert Hannon, Subramanian S. Iyer, Gerd Pfeiffer, Kevin R. Winstel | 2013-02-12 |
| 8298908 | Structure and method for forming isolation and buried plate for trench capacitor | Abhishek Dube, Subramanian S. Iyer, Babar A. Khan, Oh-Jung Kwon, Junedong Lee +4 more | 2012-10-30 |
| 8298907 | Structure and method of forming enhanced array device isolation for implanted plate eDRAM | Herbert L. Ho, Naoyoshi Kusaba, Karen A. Nummy, Carl Radens, Geng Wang | 2012-10-30 |
| 8299530 | Structure and method to fabricate pFETS with superior GIDL by localizing workfunction | Chengwen Pei, Roger A. Booth, Jr., Kangguo Cheng, Joseph Ervin, Geng Wang | 2012-10-30 |
| 8232162 | Forming implanted plates for high aspect ratio trenches using staged sacrificial layer removal | Roger A. Booth, Jr., Kangguo Cheng, Joseph Ervin, Chengwen Pei, Geng Wang +1 more | 2012-07-31 |
| 8232163 | Lateral epitaxial grown SOI in deep trench structures and methods of manufacture | Joseph Ervin, Brian W. Messenger, Karen A. Nummy | 2012-07-31 |
| 8222104 | Three dimensional integrated deep trench decoupling capacitors | Roger A. Booth, Jr., Kangguo Cheng, Geng Wang | 2012-07-17 |