PS

Prabjit Singh

IBM: 79 patents #863 of 70,183Top 2%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
Apple: 1 patents #12,251 of 18,612Top 70%
📍 Poughkeepsie, NY: #38 of 1,613 inventorsTop 3%
🗺 New York: #813 of 115,490 inventorsTop 1%
Overall (All Time): #21,676 of 4,157,543Top 1%
82
Patents All Time

Issued Patents All Time

Showing 51–75 of 82 patents

Patent #TitleCo-InventorsDate
7816785 Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package Sushumna Iruvanti, Randall G. Kemink, Rajneesh Kumar, Steven P. Ostrander 2010-10-19
7758390 Large array surface mount technology connector cradle assembly Michael J. Domitrovits, Emanuele F. Lopergolo, Joseph George 2010-07-20
7673389 Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component Bret W. Lehman, Roger R. Schmidt 2010-03-09
7651890 Method and apparatus for prevention of solder corrosion Gary F. Goth, William P. Kostenko, John J. Loparco, John G. Torok 2010-01-26
7547231 Large array connector for coupling wafers with a printed circuit board Michael J. Domitrovits, Emanuele F. Lopergolo 2009-06-16
7440281 Thermal interface apparatus Sean Bailey, Richard Lidio Blanco, Jr., David L. Edwards, Supratik Guha, Michael D. Hillman +6 more 2008-10-21
7301770 Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more 2007-11-27
7254888 Method for manufacturing graphite-base heat sinks Richard C. Chu, Michael J. Ellsworth, Jr., Egidio Marotta 2007-08-14
7222423 Method of manufacturing a finned heat sink Michael J. Ellsworth, Jr., Egidio Marotta 2007-05-29
7133286 Method and apparatus for sealing a liquid cooled electronic device Roger R. Schmidt 2006-11-07
7109722 Apparatus and method for PCB smoke and burn detection and prevention Bruce J. Chamberlin, Timothy M. Trifilo 2006-09-19
7100281 Heat sink and method of making the same Randall G. Kemink 2006-09-05
7085135 Thermal dissipation structure and method employing segmented heat sink surface coupling to an electronic component Richard C. Chu, Michael J. Ellsworth, Jr., Egidio Marotta 2006-08-01
6940712 Electronic device substrate assembly with multilayer impermeable barrier and method of making Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons, Paul A. Zucco 2005-09-06
6918438 Finned heat sink Michael J. Ellsworth, Jr., Egidio Marotta 2005-07-19
6907917 Graphite-based heat sinks and method and apparatus for the manufacture thereof Richard C. Chu, Michael J. Ellsworth, Jr., Egidio Marotta 2005-06-21
6794571 EMC sealing system and method for an electrical enclosure Dennis R. Barringer, Daniel J. Kearney, Steven C. McIntosh, Edward J. Seminaro, Harold M. Toffler 2004-09-21
6684501 Foil heat sink and a method for fabricating same Michael J. Ellsworth, Jr., Egidio Marotta, Budy D. Notohardjono, Roger R. Schmidt 2004-02-03
6636065 System and method for a device reliability and test circuit George T. Galyon, King M. Chu, Jeffrey A. Newcomer 2003-10-21
6587345 Electronic device substrate assembly with impermeable barrier and method of making Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons 2003-07-01
6570389 Prevention of arcing in power supplies George T. Galyon, Lenas J. Hedlund, Steven J. Mazzuca, Victor A. Ronken, Yiping Yao 2003-05-27
6504208 Power MOSFET device, structures employing the same and methods of fabrication Frank E. Bosco, George T. Galyon, Steven J. Mazzuca 2003-01-07
6396286 Apparatus and method for testing computer equipment for susceptibility to neutral to ground noise King M. Chu, William M. Lorenz, Tuan D. Ngo, Gerald J. Fahr, John P. McConnell 2002-05-28
6255832 Flexible wafer level probe Budy D. Notohardjono, Roger R. Schmidt 2001-07-03
6246581 Heated PCB interconnect for cooled IC chip modules Sukhvinder S. Kang, Howard Victor Mahaney, Jr., Roger R. Schmidt 2001-06-12