Issued Patents All Time
Showing 326–335 of 335 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6253835 | Isothermal heat sink with converging, diverging channels | Richard C. Chu, Robert E. Simons | 2001-07-03 |
| 6164076 | Thermoelectric cooling assembly with thermal space transformer interposed between cascaded thermoelectric stages for improved thermal performance | Richard C. Chu, Robert E. Simons | 2000-12-26 |
| 6144013 | Local humidity control system for low temperature electronic module | Richard C. Chu, Robert E. Simons | 2000-11-07 |
| 5881944 | Multi-layer solder seal band for semiconductor substrates | David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr. +6 more | 1999-03-16 |
| 5881945 | Multi-layer solder seal band for semiconductor substrates and process | David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr. +6 more | 1999-03-16 |
| 5394299 | Topology matched conduction cooling module | Richard C. Chu, Robert E. Simons, David T. Vader | 1995-02-28 |
| 5269372 | Intersecting flow network for a cold plate cooling system | Richard C. Chu, Robert E. Simons, David T. Vader | 1993-12-14 |
| 5170319 | Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels | Richard Chao-Fan Chu, Gary F. Goth, Robert E. Simons, Michael L. Zumbrunnen | 1992-12-08 |
| 5168348 | Impingment cooled compliant heat sink | Richard C. Chu, David T. Vader | 1992-12-01 |
| 5161089 | Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same | Richard C. Chu, Gary F. Goth, Robert E. Simons, Michael L. Zumbrunnen | 1992-11-03 |