Issued Patents All Time
Showing 301–325 of 335 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6775137 | Method and apparatus for combined air and liquid cooling of stacked electronics components | Richard C. Chu, Edward F. Furey, Roger R. Schmidt, Robert E. Simons | 2004-08-10 |
| 6767766 | Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication | Richard C. Chu, Robert E. Simons | 2004-07-27 |
| 6714412 | Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use | Richard C. Chu, Roger R. Schmidt, Robert E. Simons | 2004-03-30 |
| 6705089 | Two stage cooling system employing thermoelectric modules | Richard C. Chu, Robert E. Simons | 2004-03-16 |
| 6684501 | Foil heat sink and a method for fabricating same | Egidio Marotta, Budy D. Notohardjono, Roger R. Schmidt, Prabjit Singh | 2004-02-03 |
| 6674642 | Liquid-to-air cooling system for portable electronic and computer devices | Richard C. Chu, Robert E. Simons | 2004-01-06 |
| 6650538 | Fin heat sink and airflow tube assembly employing annular airflows, and methods of fabrication thereof | Richard C. Chu, Robert E. Simons | 2003-11-18 |
| 6591898 | Integrated heat sink system for a closed electronics container | Richard C. Chu, Robert E. Simons | 2003-07-15 |
| 6587345 | Electronic device substrate assembly with impermeable barrier and method of making | Richard C. Chu, Robert E. Simons, Prabjit Singh | 2003-07-01 |
| 6587336 | Cooling system for portable electronic and computer devices | Richard C. Chu, Robert E. Simons | 2003-07-01 |
| 6557354 | Thermoelectric-enhanced heat exchanger | Richard C. Chu, Robert E. Simons | 2003-05-06 |
| 6548894 | Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication | Richard C. Chu, Robert E. Simons | 2003-04-15 |
| 6519151 | Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof | Richard C. Chu, Robert E. Simons | 2003-02-11 |
| 6490874 | Recuperative environmental conditioning unit | Richard C. Chu, Robert E. Simons | 2002-12-10 |
| 6489551 | Electronic module with integrated thermoelectric cooling assembly | Richard C. Chu, Robert E. Simons | 2002-12-03 |
| 6469375 | High bandwidth 3D memory packaging technique | William F. Beausoleil, Edmund Blackshear, William F. Shutler, Norton J. Tomassetti | 2002-10-22 |
| 6462271 | Capping structure for electronics package undergoing compressive socket actuation | Jeffrey T. Coffin, Lewis S. Goldmann, John G. Torok | 2002-10-08 |
| 6431260 | Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof | Dereje Agonafer, Richard C. Chu, Robert E. Simons | 2002-08-13 |
| 6424533 | Thermoelectric-enhanced heat spreader for heat generating component of an electronic device | Richard C. Chu, Robert E. Simons | 2002-07-23 |
| 6397618 | Cooling system with auxiliary thermal buffer unit for cooling an electronics module | Richard C. Chu, Robert E. Simons | 2002-06-04 |
| 6396700 | Thermal spreader and interface assembly for heat generating component of an electronic device | Richard C. Chu, Robert E. Simons | 2002-05-28 |
| 6366462 | Electronic module with integral refrigerant evaporator assembly and control system therefore | Richard C. Chu, Robert E. Simons | 2002-04-02 |
| 6337794 | Isothermal heat sink with tiered cooling channels | Dereje Agonafer, Richard C. Chu, Robert E. Simons | 2002-01-08 |
| 6301097 | Inflatable sealing system for low temperature electronic module | Robert E. Simons | 2001-10-09 |
| 6301109 | Isothermal heat sink with cross-flow openings between channels | Richard C. Chu, Robert E. Simons | 2001-10-09 |