Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10962297 | Multidimensional heat transfer system for cooling electronic components | Huy N. Phan | 2021-03-30 |
| 9360514 | Thermal reliability testing systems with thermal cycling and multidimensional heat transfer | Huy N. Phan | 2016-06-07 |
| 6431260 | Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof | Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2002-08-13 |
| 6337794 | Isothermal heat sink with tiered cooling channels | Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2002-01-08 |
| 5719745 | Extended surface cooling for chip stack applications | Timothy Anderson, Gregory M. Chrysler, Richard C. Chu | 1998-02-17 |
| 5704419 | Air flow distribution in integrated circuit spot coolers | Timothy Anderson, Gregory M. Chrysler, Robert E. Simons | 1998-01-06 |
| 5644687 | Methods and system for thermal analysis of electronic packages | Arnold O. Vimba | 1997-07-01 |
| 5482113 | Convertible heat exchanger for air or water cooling of electronic circuit components and the like | Timothy Anderson, Gregory M. Chrysler, Richard C. Chu, Robert E. Simons, David T. Vader | 1996-01-09 |
| 5370178 | Convertible cooling module for air or water cooling of electronic circuit components | Timothy Anderson, Gregory M. Chrysler, Richard Chao-Fan Chu, Robert E. Simons, David T. Vader | 1994-12-06 |
| 4757370 | Circuit package cooling technique with liquid film spreading downward across package surface without separation | Richard C. Chu, Robert E. Simons | 1988-07-12 |