| 5482113 |
Convertible heat exchanger for air or water cooling of electronic circuit components and the like |
Dereje Agonafer, Timothy Anderson, Gregory M. Chrysler, Richard C. Chu, Robert E. Simons |
1996-01-09 |
| 5463872 |
High performance thermal interface for low temperature electronic modules |
Vincent C. Vasile |
1995-11-07 |
| 5456081 |
Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability |
Gregory M. Chrysler, Richard C. Chu, Robert E. Simons |
1995-10-10 |
| 5394299 |
Topology matched conduction cooling module |
Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons |
1995-02-28 |
| 5370178 |
Convertible cooling module for air or water cooling of electronic circuit components |
Dereje Agonafer, Timothy Anderson, Gregory M. Chrysler, Richard Chao-Fan Chu, Robert E. Simons |
1994-12-06 |
| 5303555 |
Electronics package with improved thermal management by thermoacoustic heat pumping |
Gregory M. Chrysler |
1994-04-19 |
| 5269372 |
Intersecting flow network for a cold plate cooling system |
Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons |
1993-12-14 |
| 5168348 |
Impingment cooled compliant heat sink |
Richard C. Chu, Michael J. Ellsworth, Jr. |
1992-12-01 |
| 5097385 |
Super-position cooling |
Richard Chao-Fan Chu, Robert E. Simons |
1992-03-17 |
