MB

Markus Brink

IBM: 75 patents #933 of 70,183Top 2%
ZE Zeon: 3 patents #220 of 734Top 30%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
Applied Materials: 1 patents #4,780 of 7,310Top 70%
GU Globalfoundries U.S.: 1 patents #22 of 211Top 15%
📍 White Plains, NY: #22 of 917 inventorsTop 3%
🗺 New York: #891 of 115,490 inventorsTop 1%
Overall (All Time): #23,521 of 4,157,543Top 1%
78
Patents All Time

Issued Patents All Time

Showing 51–75 of 78 patents

Patent #TitleCo-InventorsDate
10505096 Three-dimensional integration for qubits on multiple height crystalline dielectric Sami Rosenblatt, Rasit Onur Topaloglu 2019-12-10
10503077 Shadow mask area correction for tunnel junctions Sami Rosenblatt, Bryan D. Trimm 2019-12-10
10497746 Three-dimensional integration for qubits on crystalline dielectric Sami Rosenblatt, Rasit Onur Topaloglu 2019-12-03
10431866 Microfabricated air bridges for planar microwave resonator circuits Vivekananda P. Adiga 2019-10-01
10396268 Qubit network non-volatile identification Jared Barney Hertzberg, Sami Rosenblatt 2019-08-27
10367134 Shadow mask sidewall tunnel junction for quantum computing Sami Rosenblatt 2019-07-30
10361354 Shadow mask sidewall tunnel junction for quantum computing Sami Rosenblatt 2019-07-23
10355193 Flip chip integration on qubit chips Sami Rosenblatt, Jason S. Orcutt, Martin O. Sandberg, Vivekananda P. Adiga, Nicholas Torleiv Bronn 2019-07-16
10305015 Low loss architecture for superconducting qubit circuits Antonio Corcoles-Gonzalez, Jay M. Gambetta, Sami Rosenblatt, Firat Solgun 2019-05-28
10263170 Bumped resonator structure Antonio Corcoles-Gonzalez, Jay M. Gambetta, Sami Rosenblatt, Firat Solgun 2019-04-16
10256139 Chemoepitaxy etch trim using a self aligned hard mask for metal line to via Michael A. Guillorn, Chung-Hsun Lin, HsinYu Tsai 2019-04-09
10256392 Vertical transmon qubit device Sami Rosenblatt, Rasit Onur Topaloglu 2019-04-09
10243132 Vertical josephson junction superconducting device Sami Rosenblatt, Rasit Onur Topaloglu 2019-03-26
10059820 Hybrid topographical and chemical pre-patterns for directed self-assembly of block copolymers Joy Cheng, Alexander Friz, Michael A. Guillorn, Chi-Chun Liu, Daniel P. Sanders +3 more 2018-08-28
10037398 Pattern decomposition method for wiring patterns with chemoepitaxy based directed self assembly Joy Cheng, Gregory S. Doerk, Michael A. Guillorn, Kafai Lai, HsinYu Tsai 2018-07-31
9914118 Nanogap structure for micro/nanofluidic systems formed by sacrificial sidewalls Yann Astier, Michael F. Lofaro, Joshua T. Smith 2018-03-13
9782773 Nanogap structure for micro/nanofluidic systems formed by sacrificial sidewalls Yann Astier, Michael F. Lofaro, Joshua T. Smith 2017-10-10
9738765 Hybrid topographical and chemical pre-patterns for directed self-assembly of block copolymers Joy Cheng, Gregory S. Doerk, Alexander Friz, Michael A. Guillorn, Chi-Chun Liu +4 more 2017-08-22
9728421 High aspect ratio patterning of hard mask materials by organic soft masks Sebastian U. Engelmann, Eric A. Joseph, Hiroyuki Miyazoe 2017-08-08
9691615 Chemoepitaxy-based directed self assembly process with tone inversion for unidirectional wiring Joy Cheng, Gregory S. Doerk, Michael A. Guillorn, HsinYu Tsai 2017-06-27
9646883 Chemoepitaxy etch trim using a self aligned hard mask for metal line to via Michael A. Guillorn, Chung-Hsun Lin, HsinYu Tsai 2017-05-09
9633948 Low energy etch process for nitrogen-containing dielectric layer Robert L. Bruce, Sebastian U. Engelmann, Nicholas C. M. Fuller, Hiroyuki Miyazoe, Masahiro Nakamura 2017-04-25
9466534 Cointegration of directed self assembly and sidewall image transfer patterning for sublithographic patterning with improved design flexibility Josephine B. Chang, Michael A. Guillorn, Hsinuyu Tsai 2016-10-11
9437443 Low-temperature sidewall image transfer process using ALD metals, metal oxides and metal nitrides Michael A. Guillorn, Sebastian U. Engelmann, Hiroyuki Miyazoe, Adam M. Pyzyna, Jeffrey W. Sleight 2016-09-06
9190316 Low energy etch process for nitrogen-containing dielectric layer Robert L. Bruce, Sebastian U. Engelmann, Nicholas C. M. Fuller, Hiroyuki Miyazoe, Masahiro Nakamura 2015-11-17