Issued Patents All Time
Showing 26–50 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9684759 | De-coupling capacitance placement | Joachim Keinert, Sourav Saha, Thomas Strach | 2017-06-20 |
| 9679099 | De-coupling capacitance placement | Joachim Keinert, Sourav Saha, Thomas Strach | 2017-06-13 |
| 9658853 | Techniques for increasing instruction issue rate and reducing latency in an out-of order processor | Tim Niggemeier | 2017-05-23 |
| 9633928 | Through-silicon via access device for integrated circuits | Joachim Keinert, Sridhar H. Rangarajan, Haoxing Ren, Sourav Saha | 2017-04-25 |
| 9569580 | Integrated circuit design changes using through-silicon vias | Joachim Keinert, Sridhar H. Rangarajan, Haoxing Ren, Sourav Saha | 2017-02-14 |
| 9501603 | Integrated circuit design changes using through-silicon vias | Joachim Keinert, Sridhar H. Rangarajan, Haoxing Ren, Sourav Saha | 2016-11-22 |
| 9437285 | Write address synchronization in 2 read/1write SRAM arrays | Silke Penth, Wolfgang Penth, Tobias Werner | 2016-09-06 |
| 9412682 | Through-silicon via access device for integrated circuits | Joachim Keinert, Sridhar H. Rangarajan, Haoxing Ren, Sourav Saha | 2016-08-09 |
| 9406375 | Write address synchronization in 2 read/1write SRAM arrays | Silke Penth, Wolfgang Penth, Tobias Werner | 2016-08-02 |
| 9395996 | Pipelining out-of-order instructions | Tim Niggemeier | 2016-07-19 |
| 9337122 | Transferring heat through an optical layer of integrated circuitry | Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber, Norbert M. Meier +5 more | 2016-05-10 |
| 9268738 | Three-dimensional permute unit for a single-instruction multiple-data processor | Tim Niggemeier | 2016-02-23 |
| 9064080 | Transferring heat through an optical layer of integrated circuitry | Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber, Norbert M. Meier +5 more | 2015-06-23 |
| 9058461 | Transferring heat through an optical layer of integrated circuitry | Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber, Norbert M. Meier +5 more | 2015-06-16 |
| 8989532 | Integrated circuit package connected to an optical data transmission medium using a coolant | Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber, Norbert M. Meier +5 more | 2015-03-24 |
| 8984314 | Charge recycling between power domains of integrated circuits | Joachim Keinert, Antje Mueller, Tim Niggemeier | 2015-03-17 |
| 8972758 | Charge recycling between power domains of integrated circuits | Joachim Keinert, Antje Mueller, Tim Niggemeier | 2015-03-03 |
| 8806253 | Power down of execution units for issued instruction accumulation when issue rate of instructions falls below threshold and at least two are independent | Tim Niggemeier, Maarten J. Boersma, Gunnar Spiess | 2014-08-12 |
| 8805132 | Integrated circuit package connected to a data transmission medium | Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber, Norbert M. Meier +5 more | 2014-08-12 |
| 8578196 | Zero indication forwarding for floating point unit power reduction | Maarten J. Boersma, Silvia M. Mueller, Tim Niggemeier, Jochen Preiss | 2013-11-05 |
| 8476112 | Optimized semiconductor packaging in a three-dimensional stack | Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier +2 more | 2013-07-02 |
| 8427833 | Thermal power plane for integrated circuits | Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier +2 more | 2013-04-23 |
| 8421500 | Integrated circuit with stacked computational units and configurable through vias | Tim Niggemeier | 2013-04-16 |
| 8405998 | Heat sink integrated power delivery and distribution for integrated circuits | Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier +2 more | 2013-03-26 |
| 8375345 | Soft-bounded hierarchical synthesis | Harald Mielich, Friedrich Schröder, Alexander Wörner | 2013-02-12 |