Issued Patents All Time
Showing 51–75 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8789003 | Millimeter wave phase shifters using tunable transmission lines | Alberto Valdes Garcia, Wayne H. Woods, Jr. | 2014-07-22 |
| 8779870 | Low phase variation CMOS digital attenuator | Pinping Sun, Wayne H. Woods, Jr. | 2014-07-15 |
| 8748308 | Through wafer vias and method of making same | Alvin J. Joseph, Anthony K. Stamper | 2014-06-10 |
| 8680689 | Coplanar waveguide for stacked multi-chip systems | Timothy H. Daubenspeck, Wolfgang Sauter, Guoan Wang, Wayne H. Woods, Jr. | 2014-03-25 |
| 8645898 | Structure and design structure for high-Q value inductor and method of manufacturing the same | Mete Erturk, Robert A. Groves, Zhong-Xiang He, Peter J. Lindgren, Anthony K. Stamper | 2014-02-04 |
| 8643431 | On-chip millimeter wave lange coupler | Kwan Him Lam | 2014-02-04 |
| 8643191 | On-chip radial cavity power divider/combiner | Pinping Sun, Guoan Wang, Wayne H. Woods, Jr. | 2014-02-04 |
| 8592876 | Micro-electro-mechanical system (MEMS) capacitive OHMIC switch and design structures | Qizhi Liu, Anthony K. Stamper | 2013-11-26 |
| 8589832 | On chip shielding structure for integrated circuits or devices on a substrate and method of shielding | Kai D. Feng, Zhong-Xiang He, Xuefeng Liu | 2013-11-19 |
| 8581648 | High frequency quadrature PLL circuit and method | Kai D. Feng, Zhenrong Jin, Francis F. Szenher | 2013-11-12 |
| 8566759 | Structure for on chip shielding structure for integrated circuits or devices on a substrate | Kai D. Feng, Zhong-Xiang He, Xuefeng Liu | 2013-10-22 |
| 8519892 | Integrated millimeter wave antenna and transceiver on a substrate | Kai D. Feng, Zhong-Xiang He, Zhenrong Jin, Xuefeng Liu | 2013-08-27 |
| 8518787 | Through wafer vias and method of making same | Alvin J. Joseph, Anthony K. Stamper | 2013-08-27 |
| 8514028 | Load tolerant voltage controlled oscillator (VCO), IC and CMOS IC including the VCO | Pinping Sun, Hailing Wang | 2013-08-20 |
| 8508314 | On-chip variable delay transmission line with fixed characteristic impedance | Wayne H. Woods, Jr. | 2013-08-13 |
| 8476988 | Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance | Wayne H. Woods, Jr. | 2013-07-02 |
| 8455351 | Method of forming an integrated circuit interconnect structure | Ronald G. Filippi, Jong-Ru Guo, Ping-Chuan Wang | 2013-06-04 |
| 8446014 | Integrated circuit interconnect structure | Ronald G. Filippi, Jong-Ru Guo, Ping-Chuan Wang | 2013-05-21 |
| 8436446 | Method, structure, and design structure for a through-silicon-via Wilkinson power divider | Alvin J. Joseph, Wayne H. Woods, Jr. | 2013-05-07 |
| 8421183 | Structure of very high insertion loss of the substrate noise decoupling | Kai D. Feng, Zhong-Xiang He, Xuefeng Liu | 2013-04-16 |
| 8415999 | High frequency quadrature PLL circuit and method | Kai D. Feng, Zhenrong Jin, Francis F. Szenher | 2013-04-09 |
| 8413098 | T-connections, methodology for designing T-connections, and compact modeling of T-connections | Essam Mina, Guoan Wang, Wayne H. Woods, Jr. | 2013-04-02 |
| 8405453 | Millimeter-wave on-chip switch employing frequency-dependent inductance for cancellation of off-state capacitance | Wayne H. Woods, Jr., Guoan Wang | 2013-03-26 |
| 8399927 | Semiconductor structure including a high performance fet and a high voltage fet on an SOI substrate | Kai D. Feng, Zhong-Xiang He, Zhenrong Jin, Xuefeng Liu, Yun Shi | 2013-03-19 |
| 8384224 | Through wafer vias and method of making same | Alvin J. Joseph, Anthony K. Stamper | 2013-02-26 |