Issued Patents All Time
Showing 26–50 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349661 | Wafer thinning endpoint detection for TSV technology | Oleg Gluschenkov, Ping-Chuan Wang, Lin Zhou | 2016-05-24 |
| 9263782 | Notch filter structure with open stubs in semiconductor substrate and design structure | Renata Camillo-Castillo, Anthony K. Stamper | 2016-02-16 |
| 9236361 | Millimeter wave wafer level chip scale packaging (WLCSP) device | Richard S. Graf, Gary R. Hill, Wayne H. Woods, Jr. | 2016-01-12 |
| 9217769 | Ring oscillator testing with power sensing resistor | Kai D. Feng, Hailing Wang, Zhijian Yang | 2015-12-22 |
| 9214726 | High frequency phase shifter array testing | Adem G. Aydin | 2015-12-15 |
| 9208938 | Inductor structure having embedded airgap | Anthony K. Stamper | 2015-12-08 |
| 9171121 | Method, structure, and design structure for a through-silicon-via Wilkinson power divider | Alvin J. Joseph, Wayne H. Woods, Jr. | 2015-10-27 |
| 9159692 | Millimeter wave wafer level chip scale packaging (WLCSP) device and related method | Richard S. Graf, Gary R. Hill, Wayne H. Woods, Jr. | 2015-10-13 |
| 9103855 | Radiation signal measurement system for millimeter wave transceivers | Randall M. Burnett, Kai D. Feng, Donald J. Papae, Francis F. Szenher | 2015-08-11 |
| 9059183 | Structure of very high insertion loss of the substrate noise decoupling | Kai D. Feng, Zhong-Xiang He, Xuefeng Liu | 2015-06-16 |
| 9059051 | Inline measurement of through-silicon via depth | J. Edwin Hostetter, Ping-Chuan Wang, Kimball M. Watson | 2015-06-16 |
| 9059494 | Marchand balun structure and design method | Yan Ding | 2015-06-16 |
| 9054793 | Structure, system and method for device radio frequency (RF) reliability | Donald J. Cook, Xuefeng Liu, Randy L. Wolf | 2015-06-09 |
| 9006797 | Micro-electro-mechanical system (MEMS) capacitive ohmic switch and design structures | Qizhi Liu, Anthony K. Stamper | 2015-04-14 |
| 8994393 | High-frequency cobra probe | John Ferrario, Barton E. Green, Richard St. Pierre | 2015-03-31 |
| 8947160 | On-chip millimeter wave Lange coupler | Kwan Him Lam | 2015-02-03 |
| 8907470 | Millimeter wave wafer level chip scale packaging (WLCSP) device and related method | Richard S. Graf, Gary R. Hill, Wayne H. Woods, Jr. | 2014-12-09 |
| 8900964 | Inductors and wiring structures fabricated with limited wiring material | Jeffrey P. Gambino, Zhong-Xiang He, Alvin J. Joseph, Anthony K. Stamper, Timothy D. Sullivan | 2014-12-02 |
| 8898605 | On-chip tunable transmission lines, methods of manufacture and design structures | Guoan Wang, Wayne H. Woods, Jr. | 2014-11-25 |
| 8859300 | On chip inductor with frequency dependent inductance | Wayne H. Woods, Jr. | 2014-10-14 |
| 8860191 | On-chip transmission line structures with balanced phase delay | Kai D. Feng, Zhong-Xiang He, Xuefeng Liu | 2014-10-14 |
| 8853693 | Test structure for determination of TSV depth | Kai D. Feng, Ping-Chuan Wang, Zhijian Yang | 2014-10-07 |
| 8823136 | On chip inductor with frequency dependent inductance | Wayne H. Woods, Jr. | 2014-09-02 |
| 8806415 | Integrated circuit pad modeling | Kai D. Feng, Hailing Wang | 2014-08-12 |
| 8791771 | Reconfigurable Wilkinson power divider and design structure thereof | Guoan Wang, Wayne H. Woods, Jr., Jiansheng Xu | 2014-07-29 |