Issued Patents All Time
Showing 51–75 of 166 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9453863 | Implementing frequency spectrum analysis using causality Hilbert Transform results of VNA-generated S-parameter model information | Matthew S. Doyle, Richard Ericson, Wesley D. Martin, George Russell Zettles, IV | 2016-09-27 |
| 9438606 | Environmental-based location monitoring | Darryl J. Becker, Matthew S. Doyle, Mark O. Maxson | 2016-09-06 |
| 9341670 | Residual material detection in backdrilled stubs | Darryl J. Becker, Matthew S. Doyle, Philip Raymond Germann, Mark O. Maxson | 2016-05-17 |
| 9312199 | Intelligent chip placement within a three-dimensional chip stack | Darryl J. Becker, Philip Raymond Germann, William Paul Hovis | 2016-04-12 |
| 9310827 | Multiple active vertically aligned cores for three-dimensional chip stack | Darryl J. Becker, William Paul Hovis | 2016-04-12 |
| 9281261 | Intelligent chip placement within a three-dimensional chip stack | Darryl J. Becker, Philip Raymond Germann, William Paul Hovis | 2016-03-08 |
| 9265155 | Flexible rework device | David J. Braun, John R. Dangler, Matthew S. Doyle, Thomas D. Kidd | 2016-02-16 |
| 9245813 | Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance | Charles L. Johnson, John E. Kelly, III, Joseph Kuczynski, David R. Motschman, Arvind K. Sinha +2 more | 2016-01-26 |
| 9207275 | Interconnect solder bumps for die testing | Philip Raymond Germann, William Paul Hovis | 2015-12-08 |
| 9111899 | Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks | Charles L. Johnson, John E. Kelly, III, Joseph Kuczynski, David R. Motschman, Arvind K. Sinha +2 more | 2015-08-18 |
| 9003559 | Continuity check monitoring for microchip exploitation detection | Darryl J. Becker, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson +1 more | 2015-04-07 |
| 8823090 | Field-effect transistor and method of creating same | Darryl J. Becker, Philip Raymond Germann, Andrew Benson Maki, John E. Sheets, II | 2014-09-02 |
| 8796578 | Implementing selective rework for chip stacks and silicon carrier assemblies | Darryl J. Becker, Philip Raymond Germann, Andrew Benson Maki | 2014-08-05 |
| 8788748 | Implementing memory interface with configurable bandwidth | John Michael Borkenhagen, Philip Raymond Germann | 2014-07-22 |
| 8736068 | Hybrid bonding techniques for multi-layer semiconductor stacks | Russell D. Hoover, Charles L. Johnson, Steven Paul VanderWiel | 2014-05-27 |
| 8642456 | Implementing semiconductor signal-capable capacitors with deep trench and TSV technologies | Philip Raymond Germann, John E. Sheets, II | 2014-02-04 |
| 8639879 | Sorting movable memory hierarchies in a computer system | John Michael Borkenhagen, Philip Raymond Germann, William Paul Hovis | 2014-01-28 |
| 8519304 | Implementing selective rework for chip stacks and silicon carrier assemblies | Darryl J. Becker, Philip Raymond Germann, Andrew Benson Maki | 2013-08-27 |
| 8492903 | Through silicon via direct FET signal gating | Philip Raymond Germann, David P. Paulsen, John E. Sheets, II | 2013-07-23 |
| 8466024 | Power domain controller with gated through silicon via having FET with horizontal channel | Darryl J. Becker, Philip Raymond Germann, Andrew Benson Maki, John E. Sheets, II | 2013-06-18 |
| 8445918 | Thermal enhancement for multi-layer semiconductor stacks | Russell D. Hoover, Charles L. Johnson, Steven Paul VanderWiel | 2013-05-21 |
| 8367478 | Method and system for internal layer-layer thermal enhancement | Charles L. Johnson, John E. Kelly, III, David R. Motschman | 2013-02-05 |
| 8330489 | Universal inter-layer interconnect for multi-layer semiconductor stacks | Russell D. Hoover, Charles L. Johnson, Steven Paul VanderWiel, Patrick R. Varekamp | 2012-12-11 |
| 8332659 | Signal quality monitoring to defeat microchip exploitation | Darryl J. Becker, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2012-12-11 |
| 8299608 | Enhanced thermal management of 3-D stacked die packaging | David R. Motschman, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei, Jiantao Zheng | 2012-10-30 |