Issued Patents All Time
Showing 76–100 of 166 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8293578 | Hybrid bonding techniques for multi-layer semiconductor stacks | Russell D. Hoover, Charles L. Johnson, Steven Paul VanderWiel | 2012-10-23 |
| 8255628 | Structure for multi-level memory architecture with data prioritization | John Michael Borkenhagen, Philip Raymond Germann, William Paul Hovis | 2012-08-28 |
| 8214657 | Resistance sensing for defeating microchip exploitation | Darryl J. Becker, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson +1 more | 2012-07-03 |
| 8174103 | Enhanced architectural interconnect options enabled with flipped die on a multi-chip package | Darryl J. Becker, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2012-05-08 |
| 8172140 | Doped implant monitoring for microchip tamper detection | Darryl J. Becker, Todd A. Christensen, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki +2 more | 2012-05-08 |
| 8140297 | Three dimensional chip fabrication | Charles L. Johnson, Mark M. Thornton, Patrick R. Varekamp | 2012-03-20 |
| 8108647 | Digital data architecture employing redundant links in a daisy chain of component modules | Darryl J. Becker, John Michael Borkenhagen, Philip Raymond Germann, William Paul Hovis, Mark O. Maxson | 2012-01-31 |
| 8079134 | Method of enhancing on-chip inductance structure utilizing silicon through via technology | Andrew Benson Maki, Philip Raymond Germann, Mark O. Maxson, Darryl J. Becker, Paul Eric Dahlen +1 more | 2011-12-20 |
| 8037258 | Structure for dual-mode memory chip for high capacity memory subsystem | John Michael Borkenhagen, Philip Raymond Germann | 2011-10-11 |
| 8037270 | Structure for memory chip for high capacity memory subsystem supporting replication of command data | John Michael Borkenhagen, Philip Raymond Germann | 2011-10-11 |
| 8037272 | Structure for memory chip for high capacity memory subsystem supporting multiple speed bus | John Michael Borkenhagen, Philip Raymond Germann | 2011-10-11 |
| 8019949 | High capacity memory subsystem architecture storing interleaved data for reduced bus speed | John Michael Borkenhagen, Philip Raymond Germann | 2011-09-13 |
| 7996641 | Structure for hub for supporting high capacity memory subsystem | John Michael Borkenhagen, Philip Raymond Germann | 2011-08-09 |
| 7989918 | Implementing tamper evident and resistant detection through modulation of capacitance | Todd A. Christensen, Paul Eric Dahlen, John E. Sheets, II | 2011-08-02 |
| 7952478 | Capacitance-based microchip exploitation detection | Darryl J. Becker, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2011-05-31 |
| 7954081 | Implementing enhanced wiring capability for electronic laminate packages | Darryl J. Becker, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson +1 more | 2011-05-31 |
| 7945883 | Apparatus, and computer program for implementing vertically coupled noise control through a mesh plane in an electronic package design | Darryl J. Becker, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2011-05-17 |
| 7921264 | Dual-mode memory chip for high capacity memory subsystem | John Michael Borkenhagen, Philip Raymond Germann | 2011-04-05 |
| 7921271 | Hub for supporting high capacity memory subsystem | John Michael Borkenhagen, Philip Raymond Germann | 2011-04-05 |
| 7884625 | Capacitance structures for defeating microchip tampering | Darryl J. Becker, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2011-02-08 |
| 7882479 | Method and apparatus for implementing redundant memory access using multiple controllers on the same bank of memory | Darryl J. Becker, John Michael Borkenhagen, Paul Eric Dahlen, Philip Raymond Germann, William Paul Hovis | 2011-02-01 |
| 7873773 | Multi-node architecture with daisy chain communication link configurable to operate in unidirectional and bidirectional modes | John Michael Borkenhagen, Robert Allen Drehmel, James Anthony Marcella | 2011-01-18 |
| 7852103 | Implementing at-speed Wafer Final Test (WFT) with complete chip coverage | Darryl J. Becker, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson +1 more | 2010-12-14 |
| 7844769 | Computer system having an apportionable data bus and daisy chained memory chips | Darryl J. Becker, John Michael Borkenhagen, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki +1 more | 2010-11-30 |
| 7838336 | Method and structure for dispensing chip underfill through an opening in the chip | Darryl J. Becker, Paul Eric Dahlen, Philip Raymond Germann, Andrew Benson Maki, Mark O. Maxson | 2010-11-23 |