WC

Won Kyoung Choi

SC Stats Chippac: 28 patents #83 of 425Top 20%
HM Hyundai Motor: 23 patents #343 of 11,886Top 3%
Samsung: 10 patents #13,191 of 75,807Top 20%
KM Kia Motors: 8 patents #631 of 7,429Top 9%
AR Agency For Science, Technology And Research: 1 patents #909 of 2,337Top 40%
SI Seiko Instruments: 1 patents #836 of 1,437Top 60%
JC Jcet Semiconductor (Shaoxing) Co.: 1 patents #18 of 38Top 50%
📍 Singapore, SG: #45 of 13,971 inventorsTop 1%
Overall (All Time): #35,483 of 4,157,543Top 1%
63
Patents All Time

Issued Patents All Time

Showing 26–50 of 63 patents

Patent #TitleCo-InventorsDate
9842798 Semiconductor device and method of forming a PoP device with embedded vertical interconnect units Pandi C. Marimuthu, Yaojian Lin, Kang Chen, Yu Gu 2017-12-12
9837336 Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief Chang Bum Yong, Jae Hun Ku 2017-12-05
9754897 Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits Yaojian Lin, Byung Joon Han, Rajendra D. Pendse, Il Kwon Shim, Pandi C. Marimuthu +1 more 2017-09-05
9738160 Fail-safe method and apparatus for high voltage parts in a hybrid vehicle Su Hyun Bae, Young Kook Lee, Seong Yeop Lim, Sung Kyu Kim, Jin Hwan Jung +1 more 2017-08-22
9721922 Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package Pandi C. Marimuthu, Yaojian Lin, Il Kwon Shim 2017-08-01
9704780 Semiconductor device and method of forming low profile fan-out package with vertical interconnection units Pandi C. Marimuthu, Il Kwon Shim, Yaojian Lin 2017-07-11
9669728 System and method for controlling LDC of hybrid vehicle Jee Heon Kim, Hyun Wook Seong, Dong-Jun Lee 2017-06-06
9601462 Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer Chang Beom Yong, Jae Hun Ku 2017-03-21
9559004 Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy Byung Joon Han, Il Kwon Shim 2017-01-31
9527723 Semiconductor device and method of forming microelectromechanical systems (MEMS) package Yaojian Lin, Kang Chen, Ivan Micallef 2016-12-27
9355993 Integrated circuit system with debonding adhesive and method of manufacture thereof Pandi C. Marimuthu 2016-05-31
9236805 System and method for controlling DC-DC converter Hui Sung Jang, Sung Kyu Kim, Mu Shin Kwak, Hyun Wook Seong, Su Hyun Bae 2016-01-12
9184139 Semiconductor device and method of reducing warpage using a silicon to encapsulant ratio Pandi C. Marimuthu 2015-11-10
9172316 Inverter control method and system for eco-friendly vehicle Su Hyun Bae, Sung Kyu Kim, Mu Shin Kwak 2015-10-27
9105532 Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure Pandi C. Marimuthu 2015-08-11
9076724 Integrated circuit system with debonding adhesive and method of manufacture thereof Pandi C. Marimuthu 2015-07-07
9007013 Inverter control method and system for eco-friendly vehicle Su Hyun Bae, Sung Kyu Kim, Mu Shin Kwak 2015-04-14
8994304 Method for controlling interior permanent magnet synchronous motor Su Hyun Bae, Sung Kyu Kim, Mu Shin Kwak, Jul Ki Seok, Se Hwan Kim 2015-03-31
8912650 Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation Pandi C. Marimuthu 2014-12-16
8890315 Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure Pandi C. Marimuthu 2014-11-18
8809191 Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer Chang Bum Yong, Jae Hun Ku 2014-08-19
8787950 Mobile terminal and method for transmitting message thereof 2014-07-22
8742591 Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief Chang Bum Yong, Jae Hun Ku 2014-06-03
8729695 Wafer level package and a method of forming a wafer level package Chirayarikathu Veedu Sankarapillai Premachandran, Rakesh Kumar, Nagarajan Ranganathan, Ebin Liao, Yasuyuki Mitsuoka +2 more 2014-05-20
8686671 Method for compensating nonlinearity of resolver for hybrid and fuel cell vehicles Woo Yong Jeon, Shin Hye Chun, Bum Sik Kim, Young Kook Lee, Jin Hwan Jung +2 more 2014-04-01