Issued Patents All Time
Showing 51–63 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8587120 | Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure | Pandi C. Marimuthu | 2013-11-19 |
| 8517249 | Soldering structure and method using Zn | Chang-youl Moon, Yoon Chul SON, Young-Ho Kim, Hee Ra Roh, Chang Yul Oh | 2013-08-27 |
| 8508067 | Motor drive system for hybrid vehicle and method for controlling the same in the event of failure | Hong Seok Song, Ki Jong Lee, Ki Young Jang, Shin Hye Chun, Hyong Joon Park +2 more | 2013-08-13 |
| 8435881 | Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation | Pandi C. Marimuthu | 2013-05-07 |
| 8380377 | Method for controlling cooling of power converter for hybrid electric vehicle | Jong Kyung Lim, Byeong Seob Song, Hong Seok Song, Ki Jong Lee, Shin Hye Chun +2 more | 2013-02-19 |
| 7828707 | Image drum for selectively absorbing toner thereon | Chang-seung Lee, Kwang Choon Ro, Kae-dong Back, Kyu-ho Shin, Jong-Kwang Kim +2 more | 2010-11-09 |
| 7784177 | Method of manufacturing an image drum | Kae-dong Back, Ki-deok Bae, Chang-youl Moon, Kyu-ho Shin, Soon-cheol Kweon +1 more | 2010-08-31 |
| 7696104 | Mirror package and method of manufacturing the mirror package | Seung-wan Lee, Min-seog Choi, Hwa Sun Lee | 2010-04-13 |
| 7489327 | Toner adsorption image forming apparatus | Soon-cheol Kweon, Kyu-ho Shin, Kae-dong Back, Chang-youl Moon, Ki-deok Bae +1 more | 2009-02-10 |
| 7362484 | Optical scanner package with optical noise reduction | Yong-kweun Mun | 2008-04-22 |
| 7294925 | Optical scanner package having heating dam | Young-chul Ko | 2007-11-13 |
| 7219825 | SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same | Su-hee Chae, Joon-seop Kwak | 2007-05-22 |
| 7149023 | Optical scanner capable of flip-chip hermetic packaging | Young-chul Ko, Yong-kweun Mun | 2006-12-12 |