Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6504207 | Method to create EEPROM memory structures integrated with high performance logic and NVRAM, and operating conditions for the same | Bomy Chen, Jay G. Harrington, Kevin M. Houlihan, Dennis Hoyniak, Chung H. Lam +2 more | 2003-01-07 |
| 6383929 | Copper vias in low-k technology | Steven H. Boettcher, Herbert L. Ho, Mark Hoinkis, Yun-Yu Wang, Kwong Hon Wong | 2002-05-07 |
| 6310300 | Fluorine-free barrier layer between conductor and insulator for degradation prevention | Edward C. Cooney, III, Thomas L. McDevitt, Anthony K. Stamper | 2001-10-30 |
| 6214730 | Fluorine barrier layer between conductor and insulator for degradation prevention | Edward C. Cooney, III, Thomas L. McDevitt, Anthony K. Stamper | 2001-04-10 |
| 6066577 | Method for providing fluorine barrier layer between conductor and insulator for degradation prevention | Edward C. Cooney, III, Thomas L. McDevitt, Anthony K. Stamper | 2000-05-23 |
| 5930655 | Fluorine barrier layer between conductor and insulator for degradation prevention | Edward C. Cooney, III, Thomas L. McDevitt, Anthony K. Stamper | 1999-07-27 |
| 5731246 | Protection of aluminum metallization against chemical attack during photoresist development | Paul E. Bakeman, Jr., Stephen E. Luce | 1998-03-24 |
| 5480748 | Protection of aluminum metallization against chemical attack during photoresist development | Paul E. Bakeman, Jr., Stephen E. Luce | 1996-01-02 |