Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6342412 | Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 2002-01-29 |
| 6326299 | Method for manufacturing a semiconductor device | Yoshio Homma, Seiichi Kondo, Noriyuki Sakuma, Naofumi Ohashi, Toshinori Imai +1 more | 2001-12-04 |
| 6184143 | Semiconductor integrated circuit device and fabrication process thereof | Naofumi Ohashi, Hizuru Yamaguchi, Junji Noguchi | 2001-02-06 |
| 6169324 | Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 2001-01-02 |
| 6127255 | Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 2000-10-03 |
| 5811316 | Method of forming teos oxide and silicon nitride passivation layer on aluminum wiring | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 1998-09-22 |
| 5780882 | Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 1998-07-14 |
| 5739589 | Semiconductor integrated circuit device process for fabricating the same and apparatus for fabricating the same | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 1998-04-14 |
| 5607866 | Method of fabricating a semiconductor device having silicide layers for electrodes | Kazushige Sato, Atsuo Watanabe, Kenichi Kikushima, Masaya Iida | 1997-03-04 |
| 5557147 | Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 1996-09-17 |
| 5331191 | Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 1994-07-19 |
| 5244820 | Semiconductor integrated circuit device, method for producing the same, and ion implanter for use in the method | Tadashi Kamata, Mitsuharu Honda, Jun Sugiura, Hizuru Yamaguchi | 1993-09-14 |
| 5234845 | Method of manufacturing semiconductor IC using selective poly and EPI silicon growth | Atsumi Aoki, Hizuru Yamaguchi | 1993-08-10 |
| 5229643 | Semiconductor apparatus and semiconductor package | Hiroyuki Ohta, Norio Ishitsuka, Akihiro Yaguchi, Sueo Kawai, Shigeki Hirasawa | 1993-07-20 |
| 5227317 | Method of manufacturing semiconductor integrated circuit bipolar transistor device | Hizuru Uda | 1993-07-13 |
| 5220199 | Semiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrate | Kaoru Oogaya, Tohru Kobayashi, Mikinori Kawaji | 1993-06-15 |
| 5202275 | Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same | Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more | 1993-04-13 |
| 5089430 | Method of manufacturing semiconductor integrated circuit bipolar transistor device | Hizuru Uda | 1992-02-18 |
| 5073810 | Semiconductor integrated circuit device and manufacturing method thereof | Hizuru Yamaguchi, Sekiko Ozono, Atsumi Yasuda | 1991-12-17 |
| 5068710 | Semiconductor device with multilayer base contact | Mitsuaki Horiuchi, Masatoshi Tsuneoka, Tadayuki Taneoka | 1991-11-26 |
| 5060045 | Semiconductor integrated circuit device and method of manufacturing the same | Hiroyuki Akimori, Takahisa Nitta, Tohru Kobayashi, Shunji Sasabe, Mikinori Kawaji +1 more | 1991-10-22 |
| 5027188 | Semiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrate | Kaoru Oogaya, Tohru Kobayashi, Mikinori Kawaji | 1991-06-25 |